List of Intel Core processors

For a shorter list of the latest processors by Intel, see List of Intel processors § Latest.

The latest badge promoting the Intel Core branding

The following is a list of Intel Core processors. This includes the original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as Core 2 (Solo/Duo/Quad/Extreme), Core i3, Core i5, Core i7, Core i9, Core M (m3/m5/m7), Core 3, Core 5 and Core 7 branded processors.

Desktop processors

Release timeline

Desktop processors

2008	Nehalem microarchitecture (1st generation)
2009
2010	Westmere microarchitecture (1st generation)
2011	Sandy Bridge microarchitecture (2nd generation)
2012	Ivy Bridge microarchitecture (3rd generation)
2013	Haswell microarchitecture (4th generation)
2014
2015	Broadwell microarchitecture (5th generation)
	Skylake microarchitecture (6th generation)
2016
2017	Kaby Lake microarchitecture (7th generation)
	Coffee Lake microarchitecture (8th generation)
2018
2019
2020	Comet Lake microarchitecture (10th generation)
2021	Rocket Lake (11th generation)
2022	Alder Lake (12th generation)
2023	Raptor Lake (13th generation)
	Raptor Lake (14th generation)

Core 2

Main article: Intel Core 2

Front side of an Intel Core 2 Duo T7500 Processor

"Allendale" (65 nm, 800 MT/s)

For versions of the Allendale core with half the L2 cache disabled under the Pentium Dual-Core brand, see List of Intel Pentium Dual-Core microprocessors § "Allendale" (65 nm).

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
• Die size: 111 mm²
• Steppings: L2^b, M0^c, G0^d

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E4300	SL9TB (L2) SLA99 (M0) SLA5G	2	1.8 GHz	2 MB	800 MT/s	9×	0.85–1.5 V	65 W	LGA 775	January 2007	HH80557PG0332M BX80557E4300	$163
Core 2 Duo E4400	SLA3F (L2) SLA98 (M0) SLA5F	2	2 GHz	2 MB	800 MT/s	10×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PG0412M BX80557E4400	$133
Core 2 Duo E4500	SLA95 (M0)	2	2.2 GHz	2 MB	800 MT/s	11×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PG0492M BX80557E4500	$133
Core 2 Duo E4600	SLA94 (M0)	2	2.4 GHz	2 MB	800 MT/s	12×	1.162–1.312 V	65 W	LGA 775	October 2007	HH80557PG0562M BX80557E4600	$133
Core 2 Duo E4700	SLALT (G0)	2	2.6 GHz	2 MB	800 MT/s	13×	1.162–1.312 V	65 W	LGA 775	March 2008	HH80557PG0642M BX80557E4700	$133

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
• All models support: Intel VT-x
• Die size: 143 mm²
• Steppings: B2, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E6300	SL9SA (B2) SL9TA (L2) SLA2L (?) SLA5E (?)	2	1.87 GHz	2 MB	1066 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0362M BX80557E6300 BX80557E6300T2	$183
Core 2 Duo E6320	SLA4U (B2)	2	1.87 GHz	4 MB	1066 MT/s	7×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PH0364M BX80557E6320	$163
Core 2 Duo E6400	SL9S9 (B2) SLA5D (?) SL9T9 (L2) SLA97 (M0)	2	2.13 GHz	2 MB	1066 MT/s	8×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0462M BX80557E6400	$224
Core 2 Duo E6420	SLA4T (B2)	2	2.13 GHz	4 MB	1066 MT/s	8×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PH0464M BX80557E6420	$183
Core 2 Duo E6600	SL9S8 (B2) SL9ZL (B2)	2	2.4 GHz	4 MB	1066 MT/s	9×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0564M BX80557E6600	$316
Core 2 Duo E6700	SL9S7 (B2) SL9ZF (B2)	2	2.67 GHz	4 MB	1066 MT/s	10×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0674M BX80557E6700	$530

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
• All models support: Intel VT-x
• All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 143 mm²
• Transistor count: 291 million
• Steppings: B2, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E6540	SLAA5 (G0)	2	2.33 GHz	4 MB	1333 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0534M	$163
Core 2 Duo E6550	SLA9X (G0) SLAAT (?)	2	2.33 GHz	4 MB	1333 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0534MG BX80557E6550 BX80557E6550R	$163
Core 2 Duo E6750	SLA9V (G0) SLAAR (?)	2	2.67 GHz	4 MB	1333 MT/s	8×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0674MG BX80557E6750 BX80557E6750R	$183
Core 2 Duo E6850	SLA9U (G0)	2	3 GHz	4 MB	1333 MT/s	9×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0804MG BX80557E6850	$266

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 111 mm² (Conroe)
• Steppings: ?

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E6305	SLAGF	2	1.87 GHz	2 MB	1066 MT/s	7×		65 W	LGA 771		HH80557KH036F
Core 2 Duo E6405	SLAGG	2	2.13 GHz	2 MB	1066 MT/s	8×		65 W	LGA 771		HH80557KH046F

"Conroe XE" (65 nm)

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 143 mm²
• Steppings: B1, B2
• The X6900 was never publicly released.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme X6800	SL9S5 (B2) QPHV (B1)	2	2.93 GHz	4 MB	1066 MT/s	11×	0.85–1.5 V	75 W	LGA 775	July 2006	HH80557PH0677M BX80557X6800	$999
Core 2 Extreme X6900	QTOM (B2) SL9S4 (B2)	2	3.2 GHz	4 MB	1066 MT/s	12×	0.85–1.5 V	75 W	LGA 775	N/A	HH80557PH0884M	N/A

"Kentsfield" (65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 2 ×143 mm²
• Steppings: B3, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q6400	SL9UN (B3)	4	2.13 GHz	2 × 4 MB	1066 MT/s	8×	0.8500–1.500 V	105 W	LGA 775		HH80562PH0468M	OEM
Core 2 Quad Q6600	SL9UM (B3) SLACR (G0)	4	2.4 GHz	2 × 4 MB	1066 MT/s	9×	0.8500–1.500 V	105 W 95 W	LGA 775	January 2007	HH80562PH0568M BX80562Q6600 BXC80562Q6600	$851
Core 2 Quad Q6700	SLACQ (G0)	4	2.67 GHz	2 × 4 MB	1066 MT/s	10×	0.8500–1.500 V	105 W	LGA 775	July 2007	HH80562PH0678M BX80562Q6700 BXC80562Q6700	$530

"Kentsfield XE" (65 nm)

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 2 ×143 mm²
• Steppings: B3, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme QX6700	SL9UL (B3)	4	2.67 GHz	2 × 4 MB	1066 MT/s	10×	0.8500–1.500 V	130 W	LGA 775	November 2006	HH80562PH0678M	$999
Core 2 Extreme QX6800	SL9UK (B3) SLACP (G0)	4	2.93 GHz	2 × 4 MB	1066 MT/s	11×	0.8500–1.500 V	130 W	LGA 775	April 2007	HH80562PH0778M HH80562XH0778M	$1199
Core 2 Extreme QX6850	SLAFN (G0)	4	3 GHz	2 × 4 MB	1333 MT/s	9×	0.8500–1.500 V	130 W	LGA 775	July 2007	HH80562XJ0808M	$999

"Wolfdale-3M" (45 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Die size: 82 mm²
• Transistor Count: 230 million
• Steppings: M0, R0
• Models with a part number ending in "ML" instead of "M" support Intel VT-x

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E7200	SLAPC (M0) SLAVN (M0) SLB9W (?)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	0.85–1.3625 V	65 W	LGA 775	April 2008	EU80571PH0613M BX80571E7200	$133
Core 2 Duo E7300	SLAPB (M0) SLB9X (R0) SLGA9 (R0)	2	2.67 GHz	3 MB	1066 MT/s	10×	0.85–1.3625 V	65 W	LGA 775	August 2008	EU80571PH0673M AT80571PH0673M BX80571E7300	$133
Core 2 Duo E7400	SLB9Y (R0) SLGQ8 (R0) SLGW3 (R0, with VT)	2	2.8 GHz	3 MB	1066 MT/s	10.5×	0.85–1.3625 V	65 W	LGA 775	October 2008	AT80571PH0723M AT80571PH0723ML BX80571E7400	$133
Core 2 Duo E7500	SLB9Z (R0) SLGTE (R0, with VT)	2	2.93 GHz	3 MB	1066 MT/s	11×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80571PH0773M AT80571PH0773ML BX80571E7500	$133
Core 2 Duo E7600	SLGTD (R0, with VT)	2	3.07 GHz	3 MB	1066 MT/s	11.5×	0.85–1.3625 V	65 W	LGA 775	May 2009	AT80571PH0833ML BX80571E7600	$133

"Wolfdale" (45 nm, 1333 MT/s)

• All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x ^[a], Intel VT-d ^[b], Trusted Execution Technology (TXT)
• Die size: 107 mm²
• Transistor Count: 410 million
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E8190	SLAQR (C0)	2	2.67 GHz	6 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0676MN	$163
Core 2 Duo E8200	SLAPP (C0)	2	2.67 GHz	6 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0676M BX80570E8200	$163
Core 2 Duo E8290	SLAQQ (?)	2	2.83 GHz	6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	?	EU80570PJ0736MN	?
Core 2 Duo E8300	SLAPJ (C0) SLAPN (C0)	2	2.83 GHz	6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	April 2008	EU80570AJ0736M EU80570PJ0736M	$163
Core 2 Duo E8400	SLAPL (C0) SLB9J (E0)	2	3 GHz	6 MB	1333 MT/s	9×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0806M AT80570PJ0806M BX80570E8400	$183
Core 2 Duo E8500	SLAPK (C0) SLB9K (E0)	2	3.17 GHz	6 MB	1333 MT/s	9.5×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0876M AT80570PJ0876M BX80570E8500	$266
Core 2 Duo E8600	SLB9L (E0)	2	3.33 GHz	6 MB	1333 MT/s	10×	0.85–1.3625 V	65 W	LGA 775	August 2008	AT80570PJ0876M BX80570E8600	$266
Core 2 Duo E8700	SLB9E (E0)	2	3.5 GHz	6 MB	1333 MT/s	10.5×	0.85–1.3625 V	65 W	LGA 775	December 2009	AT80570PJ1006M(OEM)	NA

^a Note: The E8190 and E8290 do not support Intel VT-d.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x ^[a], Intel VT-d ^[b], Trusted Execution Technology (TXT) ^[c]
• Die size: 2 × 82 mm²
• Steppings: M0, M1, R0
• All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q8200	SLB5M (M1) SLG9S (R0)	4	2.33 GHz	2 × 2 MB	1333 MT/s	7×	0.85–1.3625 V	95 W	LGA 775	August 2008	EU80580PJ0534MN AT80580PJ0534MN	$224
Core 2 Quad Q8200S	SLG9T (R0) SLGSS (R0, with Intel VT-x)	4	2.33 GHz	2 × 2 MB	1333 MT/s	7×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80580AJ0534MN AT80580AJ0534ML	$245
Core 2 Quad Q8300	SLB5W (R0) SLGUR (R0, with Intel VT-x)	4	2.5 GHz	2 × 2 MB	1333 MT/s	7.5×	0.85–1.3625 V	95 W	LGA 775	November 2008	AT80580PJ0604MN AT80580PJ0604ML	$224
Core 2 Quad Q8400	SLGT6 (R0, with Intel VT-x)	4	2.67 GHz	2 × 2 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	April 2009	AT80580PJ0674ML	$183
Core 2 Quad Q8400S	SLGT7 (R0, with Intel VT-x)	4	2.67 GHz	2 × 2 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	April 2009	AT80580AJ0674ML	$245
Core 2 Quad Q9300	SLAMX (M0) SLAWE (M1)	4	2.5 GHz	2 × 3 MB	1333 MT/s	7.5×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80580PJ0606M	$266
Core 2 Quad Q9400	SLB6B (R0)	4	2.67 GHz	2 × 3 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	August 2008	AT80580PJ0676M	$266
Core 2 Quad Q9400S	SLG9U (R0)	4	2.67 GHz	2 × 3 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80580AJ0676M	$320
Core 2 Quad Q9500	SLGZ4 (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	January 2010	AT80580PJ0736ML	$183
Core 2 Quad Q9505	SLGYY (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	August 2009	AT80580PJ0736MG	$213
Core 2 Quad Q9505S	SLGYZ (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	August 2009	AT80580AJ0736MG	$277

^a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

^b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

^c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
• Die size: 2 × 107 mm²
• Steppings: C0, C1, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q9450	SLAN6 (C0) SLAWR (C1)	4	2.67 GHz	2 × 6 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80569PJ067N	$316
Core 2 Quad Q9550	SLAN4 (C0) SLAWQ (C1) SLB8V (E0)	4	2.83 GHz	2 × 6 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80569PJ073N AT80569PJ073N	$530
Core 2 Quad Q9550S	SLGAE (E0)	4	2.83 GHz	2 × 6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80569AJ073N	$369
Core 2 Quad Q9650	SLB8W (E0)	4	3 GHz	2 × 6 MB	1333 MT/s	9×	0.85–1.3625 V	95 W	LGA 775	August 2008	AT80569PJ080N BX80569Q9650	$530

"Yorkfield XE" (45 nm)

• These models feature an unlocked clock multiplier
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
• Intel VT-d supported by: QX9650
• Die size: 2 × 107 mm²
• Steppings: C0, C1, E0
• The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme QX9650	SLAN3 (C0) SLAWN (C1)	4	3 GHz	2 × 6 MB	1333 MT/s	9×	0.85–1.3625 V	130 W	LGA 775	November 2007	EU80569XJ080NL BX80569QX9650	$999
Core 2 Extreme QX9750	QJEE (E0) SLBBU (E0)	4	3.17 GHz	2 × 6 MB	1333 MT/s	9.5×	0.85–1.3625 V	130 W	LGA 775	N/A	AT80569XL087NL	N/A
Core 2 Extreme QX9770	SLAN2 (C0) SLAWM (C1)	4	3.2 GHz	2 × 6 MB	1600 MT/s	8×	0.85–1.3625 V	136 W	LGA 775	March 2008	EU80569XL088NL BX80569QX9770	$1399
Core 2 Extreme QX9775	SLANY (C0)	4	3.2 GHz	2 × 6 MB	1600 MT/s	8×	0.85–1.35 V	150 W	LGA 771	March 2008	EU80574XL088N BX80574QX9775	$1499

Core i (1st gen)

Lynnfield

Common features:

• Socket: LGA 1156.
• All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	880	4 (8)	3.06	3.73	8 MB	95 W	May 2010	US $583
	875K		2.93	3.60				US $342
	870						September 2009	US $562
	870S		2.67			82 W	July 2010	US $351
	860		2.80	3.46		95 W	September 2009	US $284
	860S		2.53			82 W	January 2010	US $337
Core i5	760	4 (4)	2.80	3.33		95 W	July 2010	US $205
	750		2.66	3.20			September 2009	US $196
	750S		2.40			82 W	January 2010	US $259

Bloomfield

Common features:

• Socket: LGA 1366.
• All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
• PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
• All CPUs feature a QPI bus to the chipset (northbridge).
  • Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• Extreme Edition processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	975 Extreme Edition	4 (8)	3.33	3.60	8 MB	130 W	June 2009	US $999
	965 Extreme Edition		3.20	3.46			November 2008
	960						October 2009	US $562
	950		3.06	3.33			June 2009
	940		2.93	3.20			November 2008
	930		2.80	3.06			February 2010	US $294
	920		2.66	2.93			November 2008	US $284

Clarkdale

Intel i3 540 CPU die shot (Westmere)

Intel i3 540 CPU and IGPU Dies

Common features:

• Socket: LGA 1156.
• All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i5	680	2 (4)	3.60	3.86	HD Graphics	733	4 MB	73 W	April 2010	US $294
	670		3.46	3.73					January 2010	US $284
	661		3.33	3.60		900		87 W		US $196
	660					733		73 W
	655K		3.20	3.46					May 2010	US $216
	650								January 2010	US $176
Core i3	560		3.33	—					August 2010	US $138
	550		3.20						May 2010
	540		3.06						January 2010	US $133
	530		2.93							US $113

Gulftown

Common features:

• Socket: LGA 1366.
• All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
• PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
• All CPUs feature a QPI bus to the chipset (northbridge).
  • Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	990X	6 (12)	3.46	3.73	12 MB	130 W	February 2011	US $999
	980X		3.33	3.60			March 2010
	980						June 2011	US $583
	970		3.20	3.46			July 2010	US $885

Core i (2nd gen)

Sandy Bridge-DT

Common features:

Intel i5 2500 die shot

• Socket: LGA 1155.
• All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i3-2120, i5-2400, and i7-2600 are available as embedded processors.
• The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	2700K	4 (8)	3.5	3.9	HD 3000	850–1350	8 MB	95 W	October 2011	US $332
	2600K		3.4	3.8					January 2011	US $317
	2600				HD 2000					US $294
	2600S		2.8					65 W		US $306
Core i5	2550K	4 (4)	3.4		—		6 MB	95 W	January 2012	US $225
	2500K		3.3	3.7	HD 3000	850–1100			January 2011	US $216
	2500				HD 2000					US $205
	2500S		2.7					65 W		US $216
	2500T		2.3	3.3		650–1250		45 W
	2450P		3.2	3.5	—			95 W	January 2012	US $195
	2400		3.1	3.4	HD 2000	850–1100			January 2011	US $184
	2405S		2.5	3.3	HD 3000			65 W	May 2011	US $205
	2400S				HD 2000				January 2011	US $195
	2390T	2 (4)	2.7	3.5		650–1100	3 MB	35 W	February 2011
	2380P	4 (4)	3.1	3.4	—		6 MB	95 W	January 2012	US $177
	2320		3.0	3.3	HD 2000	850–1100			September 2011
	2310		2.9	3.2					May 2011
	2300		2.8	3.1					January 2011
Core i3	2130	2 (4)	3.4	—		850–1100	3 MB	65 W	September 2011	US $138
	2125		3.3		HD 3000					US $134
	2120				HD 2000				February 2011	US $138
	2120T		2.6			650–1100		35 W		US $127
	2105		3.1		HD 3000	850–1100		65 W	May 2011	US $134
	2102				HD 2000				Q2 2011	US $127
	2100								February 2011	US $117
	2100T		2.5			650–1100		35 W		US $127

Core i (3rd gen)

Ivy Bridge-DT

Common features:

• Socket: LGA 1155.
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	3770K	4 (8)	3.5	3.9	HD 4000	650–1150	8 MB	77 W	April 2012	US $342
	3770		3.4							US $305
	3770S		3.1					65 W		US $305
	3770T		2.5	3.7				45 W		US $294
Core i5	3570K	4 (4)	3.4	3.8			6 MB	77 W		US $225
	3570				HD 2500				June 2012	US $205
	3570S		3.1					65 W
	3570T		2.3	3.3				45 W	April 2012
	3550		3.3	3.7				77 W
	3550S		3.0					65 W
	3470		3.2	3.6		650–1100		77 W	June 2012	US $184
	3475S		2.9		HD 4000			65 W		US $201
	3470S				HD 2500					US $184
	3470T	2 (4)					3 MB	35 W
	3450	4 (4)	3.1	3.5			6 MB	77 W	April 2012
	3450S		2.8					65 W
	3350P		3.1	3.3	—			69 W	September 2012	US $177
	3340				HD 2500	650–1050		77 W	September 2013	US $182
	3340S		2.8					65 W
	3330		3.0	3.2				77 W	September 2012
	3335S		2.7		HD 4000			65 W		US $194
	3330S				HD 2500					US $177
Core i3	3250	2 (4)	3.5	—			3 MB	55 W	June 2013	US $138
	3250T		3.0					35 W
	3245		3.4		HD 4000			55 W		US $134
	3240				HD 2500				September 2012	US $138
	3240T		2.9					35 W
	3225		3.3		HD 4000			55 W		US $134
	3220				HD 2500					US $117
	3220T		2.8					35 W
	3210		3.2					55 W	January 2013

Sandy Bridge-E

Common features:

• Socket: LGA 2011.
• All the CPUs support quad-channel DDR3-1600 RAM.
• All CPU models provide 40 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	3970X	6 (12)	3.5	4.0	15 MB	150 W	November 2012	US $999
	3960X		3.3	3.9		130 W	November 2011
	3930K		3.2	3.8	12 MB			US $583
	3820	4 (8)	3.6	3.8	10 MB		February 2012	US $294

Core i (4th gen)

Haswell-DT

Intel i3 4130, Haswell 22nm die shot

Common features:

• Socket: LGA 1150.
• All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	4790K	4 (8)	4.0	4.4	HD 4600	350–1250	8 MB	88 W	June 2014	US $350
	4790		3.6	4.0		350–1200		84 W	May 2014	US $312
	4790S		3.2					65 W
	4790T		2.7	3.9				45 W		US $303
	4785T		2.2	3.2				35 W
	4770K		3.5	3.9		350–1250		84 W	June 2013	US $350
	4771					350–1200			September 2013	US $320
	4770		3.4						June 2013	US $312
	4770S		3.1					65 W		US $305
	4770T		2.5	3.7				45 W		US $303
	4765T		2.0	3.0				35 W
Core i5	4690K	4 (4)	3.5	3.9			6 MB	88 W	June 2014	US $242
	4690							84 W	May 2014	US $213
	4690S		3.2					65 W
	4690T		2.5	3.5				45 W
	4670K		3.4	3.8				84 W	June 2013	US $242
	4670									US $213
	4670S		3.1					65 W
	4670T		2.3	3.3				45 W
	4590		3.3	3.7		350–1150		84 W	May 2014	US $192
	4590S		3.0					65 W
	4590T		2.0	3.0				35 W
	4570		3.2	3.6				84 W	June 2013
	4570S		2.9					65 W
	4570T	2 (4)				200–1150	4 MB	35 W
	4470	4 (4)	3.3	3.5		350–1100	6 MB	84 W	May 2014	OEM
	4460		3.2	3.4						US $182
	4460S		2.9					65 W
	4460T		1.9	2.7				35 W	March 2014
	4440		3.1	3.3				84 W	September 2013
	4440S		2.8					65 W
	4430		3.0	3.2				84 W	June 2013
	4430S		2.7					65 W
Core i3	4370	2 (4)	3.8	—		350–1150	4 MB	54 W	July 2014	US $149
	4370T		3.3			200–1150		35 W	March 2015	US $138
	4360		3.7			350–1150		54 W	May 2014	US $149
	4360T		3.2			200–1150		35 W	July 2014	US $138
	4350		3.6			350–1150		54 W	May 2014
	4350T		3.1			200–1150		35 W
	4340		3.6			350–1150		54 W	September 2013	US $149
	4330		3.5							US $138
	4330T		3.0			200–1150		35 W
	4170		3.7		HD 4400	350–1150	3 MB	54 W	March 2015	US $117
	4170T		3.2			200–1150		35 W
	4160		3.6			350–1150		54 W	July 2014
	4160T		3.1			200–1150		35 W
	4150		3.5			350–1150		54 W	May 2014
	4150T		3.0			200–1150		35 W
	4130		3.4			350–1150		54 W	September 2013	US $122
	4130T		2.9			200–1150		35 W

Haswell-H

Common features:

• Socket: BGA 1364 (soldered).
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4770R	4 (8)	3.2	3.9	Iris Pro 5200	200–1300	6 MB	65 W	June 2013
Core i5	4670R	4 (4)	3.0	3.7			4 MB
	4570R		2.7	3.2		200–1150

Ivy Bridge-E

Common features:

• Socket: LGA 2011.
• All the CPUs support quad-channel DDR3-1866 RAM.
• All CPU models provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	4960X	6 (12)	3.6	4.0	15 MB	130 W	September 2013	US $990
	4930K		3.4	3.9	12 MB			US $555
	4820K	4 (8)	3.7		10 MB			US $310

Core i (5th gen)

Broadwell-H

Common features:

• Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
• All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	5775R	4 (8)	3.3	3.8	Iris Pro 6200	300–1150	6 MB	65 W	June 2015	OEM
	5775C			3.7						US $366
Core i5	5675R	4 (4)	3.1	3.6		300–1100	4 MB			OEM
	5675C									US $276
	5575R		2.8	3.3		300–1050				OEM

Haswell-E

Common features:

• Socket: LGA 2011-3.
• All the CPUs support quad-channel DDR4-2133 RAM.
• i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	5960X	8 (16)	3.0	3.5	20 MB	140 W	August 2014	US $999
	5930K	6 (12)	3.5	3.7	15 MB			US $583
	5820K		3.3	3.6				US $389

Core i (6th gen)

Skylake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	6700K	4 (8)	4.0	4.2	HD 530	350–1150	8 MB	91 W	August 2015	US $339
	6700		3.4	4.0				65 W	September 2015	US $303
	6700T		2.8	3.6		350–1100		35 W
Core i5	6600K	4 (4)	3.5	3.9		350–1150	6 MB	91 W	August 2015	US $243
	6600		3.3					65 W	September 2015	US $213
	6600T		2.7	3.5		350–1100		35 W
	6500		3.2	3.6		350–1050		65 W		US $192
	6500T		2.5	3.1		350–1100		35 W
	6402P		2.8	3.4	HD 510	350–950		65 W	December 2015	US $182
	6400		2.7	3.3	HD 530				September 2015
	6400T		2.2	2.8				35 W
Core i3	6320	2 (4)	3.9	—		350–1150	4 MB	51 W		US $148
	6300		3.8							US $139
	6300T		3.3			350–950		35 W		US $138
	6100		3.7			350–1050	3 MB	51 W		US $117
	6100T		3.2			350–950		35 W
	6098P		3.6		HD 510	350–1050		54 W	December 2015

Skylake-H

Common features:

• Socket: BGA 1440 (soldered).
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6785R	4 (8)	3.3	3.9	Iris Pro 580	350–1150	8 MB	65 W	May 2016
Core i5	6685R	4 (4)	3.2	3.8			6 MB
	6585R		2.8	3.6		350–1100

Broadwell-E

Common features:

• Socket: LGA 2011-3.
• All the CPUs support quad-channel DDR4-2400 RAM.
• i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	6950X	10 (20)	3.0	3.5	25 MB	140 W	May 2016	US $1723
	6900K	8 (16)	3.2	3.7	20 MB			US $1089
	6850K	6 (12)	3.6	3.8	15 MB			US $617
	6800K		3.4					US $434

Core i (7th gen)

Kaby Lake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	7700K	4 (8)	4.2	4.5	HD 630	350–1150	8 MB	91 W	January 2017	US $339
	7700		3.6	4.2				65 W		US $303
	7700T		2.9	3.8				35 W
Core i5	7600K	4 (4)	3.8	4.2			6 MB	91 W		US $242
	7600		3.5	4.1				65 W		US $213
	7600T		2.8	3.7		350–1100		35 W
	7500		3.4	3.8				65 W		US $192
	7500T		2.7	3.3				35 W
	7400		3.0	3.5		350–1000		65 W		US $182
	7400T		2.4	3.0				35 W
Core i3	7350K	2 (4)	4.2	—		350–1150	4 MB	60 W		US $168
	7320		4.1					51 W		US $157
	7300		4.0							US $147
	7300T		3.5			350–1100		35 W
	7100		3.9				3 MB	51 W		US $117
	7100T		3.4					35 W

Skylake-X

For the 9th generation refresh, see section § Skylake-X (9xxx) below.

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
• i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	7980XE	18 (36)	2.6	4.2	4.4	24.75 MB	165 W	September 2017	US $1999
	7960X	16 (32)	2.8			22 MB			US $1699
	7940X	14 (28)	3.1	4.3		19.25 MB			US $1399
	7920X	12 (24)	2.9			16.5 MB	140 W	August 2017	US $1199
	7900X	10 (20)	3.3		4.5	13.75 MB		June 2017	US $989
Core i7	7820X	8 (16)	3.6			11 MB			US $599
	7800X	6 (12)	3.5	4.0	—	8.25 MB			US $389

Kaby Lake-X

Common features:

• Socket: LGA 2066.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	7740X	4 (8)	4.3	4.5	8 MB	112 W	June 2017	US $339
Core i5	7640X	4 (4)	4.0	4.2	6 MB			US $242

Core i (8th gen)

Coffee Lake-S

For the 9th generation refresh, see section § Coffee Lake-R below.

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	8086K	6 (12)	4.0	5.0	UHD 630	350–1200	12 MB	95 W	June 2018	US $425
	8700K		3.7	4.7					October 2017	US $359
	8700		3.2	4.6				65 W		US $303
	8700T		2.4	4.0				35 W	April 2018
Core i5	8600K	6 (6)	3.6	4.3		350–1150	9 MB	95 W	October 2017	US $257
	8600		3.1					65 W	April 2018	US $213
	8600T		2.3	3.7				35 W
	8500		3.0	4.1		350–1100		65 W		US $192
	8500T		2.1	3.5				35 W
	8400		2.8	4.0		350–1050		65 W	October 2017	US $182
	8400T		1.7	3.3				35 W	April 2018
Core i3	8350K	4 (4)	4.0	—		350–1150	8 MB	91 W	October 2017	US $168
	8300		3.7					62 W	April 2018	US $138
	8300T		3.2			350–1100		35 W
	8100		3.6				6 MB	65 W	October 2017	US $117
	8100F				—				January 2019
	8100T		3.1		UHD 630	350–1100		35 W	April 2018

Core i (9th gen)

Coffee Lake-R

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9-9900KS has all-core boost clock of 5.0 GHz.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i9	9900KS	8 (16)	4.0	5.0	UHD 630	350–1200	16 MB	127 W	October 2019	US $524
	9900K		3.6					95 W	October 2018	US $488
	9900KF				—				January 2019	US $463
	9900		3.1		UHD 630	350–1200		65 W	April 2019	US $439
	9900T		2.1	4.4				35 W
Core i7	9700K	8 (8)	3.6	4.9			12 MB	95 W	October 2018	US $374
	9700KF				—				January 2019
	9700		3.0	4.7	UHD 630	350–1200		65 W	April 2019	US $323
	9700F				—
	9700T		2.0	4.3	UHD 630	350–1200		35 W
Core i5	9600K	6 (6)	3.7	4.6		350–1150	9 MB	95 W	October 2018	US $262
	9600KF				—				January 2019	US $263
	9600		3.1		UHD 630	350–1150		65 W	April 2019	US $213
	9600T		2.3	3.9				35 W
	9500		3.0	4.2		350–1100		65 W		US $192
	9500F				—
	9500T		2.2	3.7	UHD 630	350–1100		35 W
	9400		2.9	4.1		350–1050		65 W	January 2019	US $182
	9400F				—
	9400T		1.8	3.4	UHD 630	350–1050		35 W	April 2019
Core i3	9350K	4 (4)	4.0	4.6		350–1150	8 MB	91 W		US $173
	9350KF				—				January 2019
	9320		3.7	4.4	UHD 630	350–1150		62 W	April 2019	US $154
	9300			4.3						US $143
	9300T		3.2	3.8		350–1100		35 W
	9100		3.6	4.2			6 MB	65 W		US $122
	9100F				—
	9100T		3.1	3.7	UHD 630	350–1100		35 W

Skylake-X (9xxx)

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2666 RAM.
• All CPU models provide 44 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	9990XE	14 (28)	4.0	5.0	5.0	19.25 MB	255 W	January 2019	OEM
	9980XE	18 (36)	3.0	4.4	4.5	24.75 MB	165 W	Q4 2018	US $1979
	9960X	16 (32)	3.1			22 MB			US $1684
	9940X	14 (28)	3.3			19.25 MB			US $1387
	9920X	12 (24)	3.5						US $1189
	9900X	10 (20)							US $989
	9820X		3.3	4.1	4.2	16.5 MB			US $889
Core i7	9800X	8 (16)	3.8	4.4	4.5			November 2018	US $589

Core i (10th gen)

Comet Lake-S

For the i3- and i5-10xx5 refresh, see section § Comet Lake-S (refresh) below.

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	TVB	Model	Clock (MHz)
Core i9	10900K	10 (20)	3.7	5.2	5.3	UHD 630	350–1200	20 MB	125 W	April 2020	US $488
	10900KF					—					US $472
	10910		3.6	5.0	—	UHD 630	350–1200			Q3 2020	OEM
	10900		2.8	5.1	5.2				65 W	April 2020	US $439
	10900F					—					US $422
	10900T		1.9	4.6	—	UHD 630	350–1200		35 W		US $439
	10850K		3.6	5.1	5.2				125 W	July 2020	US $453
Core i7	10700K	8 (16)	3.8	5.1	—			16 MB		May 2020	US $374
	10700KF					—					US $349
	10700		2.9	4.8		UHD 630	350–1200		65 W		US $323
	10700F					—					US $298
	10700T		2.0	4.5		UHD 630	350–1200		35 W		US $325
Core i5	10600K	6 (12)	4.1	4.8				12 MB	125 W	April 2020	US $262
	10600KF					—					US $237
	10600		3.3			UHD 630	350–1200		65 W		US $213
	10600T		2.4	4.0					35 W
	10500		3.1	4.5			350–1150		65 W		US $192
	10500T		2.3	3.8					35 W
	10400		2.9	4.3			350–1100		65 W		US $182
	10400F					—					US $157
	10400T		2.0	3.6		UHD 630	350–1100		35 W		US $182
Core i3	10320	4 (8)	3.8	4.6			350–1150	8 MB	65 W		US $154
	10300		3.7	4.4							US $143
	10300T		3.0	3.9			350–1100		35 W
	10100		3.6	4.3				6 MB	65 W		US $122
	10100F					—				October 2020	US $97
	10100T		3.0	3.8		UHD 630	350–1100		35 W	April 2020	US $122

Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• All models support Turbo Boost 2.0.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i5	10505	6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W	March 2021	US $192
Core i3	10325	4 (8)	3.9	4.7		350–1150	8 MB			US $154
	10305		3.8	4.5						US $143
	10305T		3.0	4.0		350–1100		35 W
	10105		3.7	4.4			6 MB	65 W		US $122
	10105F				—					US $97
	10105T		3.0	3.9	UHD 630	350–1100		35 W		US $122

Cascade Lake-X (10xxx)

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2933 RAM.
• All CPU models provide 48 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	10980XE	18 (36)	3.0	4.6	4.8	24.75 MB	165 W	October 2019	US $979
	10940X	14 (28)	3.3			19.25 MB			US $784
	10920X	12 (24)	3.5						US $689
	10900X	10 (20)	3.7	4.5	4.7				US $590

Core i (11th gen)

Rocket Lake-S

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	TVB	Model	Clock (MHz)
Core i9	11900K	8 (16)	3.5	5.2	5.3	UHD 750	350–1300	16 MB	125 W	March 2021	US $539
	11900KF					—					US $513
	11900		2.5	5.1	5.2	UHD 750	350–1300		65 W		US $439
	11900F					—					US $422
	11900T		1.5	4.9	—	UHD 750	350–1300		35 W		US $439
Core i7	11700K		3.6	5.0					125 W		US $399
	11700KF					—					US $374
	11700		2.5	4.9		UHD 750	350–1300		65 W		US $323
	11700F					—					US $298
	11700T		1.4	4.6		UHD 750	350–1300		35 W		US $323
Core i5	11600K	6 (12)	3.9	4.9				12 MB	125 W		US $262
	11600KF					—					US $237
	11600		2.8	4.8		UHD 750	350–1300		65 W		US $213
	11600T		1.7	4.1					35 W
	11500		2.7	4.6					65 W		US $192
	11500T		1.5	3.9			350–1200		35 W
	11400		2.6	4.4		UHD 730	350–1300		65 W		US $182
	11400F					—					US $157
	11400T		1.3	3.7		UHD 730	350–1200		35 W		US $182

Tiger Lake-B

Common features:

• Socket: BGA 1787 (soldered).
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• These CPUs were sold to OEMs only.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	11900KB	8 (16)	3.3	4.9	UHD Graphics (32 EU)	350–1450	24 MB	55–65 W	May 2021
Core i7	11700B		3.2	4.8
Core i5	11500B	6 (12)	3.3	4.6			12 MB	65 W
Core i3	11100B	4 (8)	3.6	4.4	UHD Graphics (16 EU)	350–1400

Core i (12th gen)

Alder Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo	TVB		Base	Turbo
Core i9	12900KS	8 (16)	3.4	5.3	5.5	8 (8)	2.5	4.0	UHD 770	300–1550	30 MB	150 W	241 W	April 2022	US $739
	12900K		3.2	5.2	—		2.4	3.9				125 W		November 2021	US $589
	12900KF								—						US $564
	12900		2.4	5.1			1.8	3.8	UHD 770	300–1550		65 W	202 W	January 2022	US $489
	12900F								—						US $464
	12900T		1.4	4.9			1.0	3.6	UHD 770	300–1550		35 W	106 W		US $489
Core i7	12700K		3.6	5.0		4 (4)	2.7	3.8		300–1500	25 MB	125 W	190 W	November 2021	US $409
	12700KF								—						US $384
	12700		2.1	4.9			1.6	3.6	UHD 770	300–1500		65 W	180 W	January 2022	US $339
	12700F								—						US $314
	12700T		1.4	4.7			1.0	3.4	UHD 770	300–1500		35 W	106 W		US $339
Core i5	12600K	6 (12)	3.7	4.9			2.8	3.6		300–1450	20 MB	125 W	150 W	November 2021	US $289
	12600KF								—						US $264
	12600		3.3	4.8		—			UHD 770	300–1450	18 MB	65 W	117 W	January 2022	US $223
	12600T		2.1	4.6								35 W	74 W
	12500		3.0									65 W	117 W		US $202
	12500T		2.0	4.4								35 W	74 W
	12490F		3.0	4.6					—		20 MB	65 W	117 W	February 2022	CN ¥1599
	12400		2.5	4.4					UHD 730	300–1450	18 MB			January 2022	US $202
	12400F								—						US $192
	12400T		1.8	4.2					UHD 730	350–1450		35 W	74 W		US $202
Core i3	12300	4 (8)	3.5	4.4							12 MB	60 W	89 W		US $143
	12300T		2.3	4.2								35 W	69 W
	12100		3.3	4.3						300–1400		60 W	89 W		US $122
	12100F								—			58 W			US $97
	12100T		2.2	4.1					UHD 730	300–1400		35 W	69 W		US $122

Core i (13th gen)

Raptor Lake-S

For the 14th generation refresh, see section § Raptor Lake-S Refresh below.

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
  • E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo	TVB		Base	Turbo
Core i9	13900KS	8 (16)	3.2	5.8	6.0	16 (16)	2.4	4.3	UHD 770	300–1650	36 MB	150 W	253 W	January 2023	US $689
	13900K		3.0	5.7	5.8		2.2					125 W		October 2022	US $589
	13900KF								—						US $564
	13900		2.0	5.5	5.6		1.5	4.2	UHD 770	300–1650		65 W	219 W	January 2023	US $549
	13900F								—						US $524
	13900T		1.1	5.3	—		0.8	3.9	UHD 770	300–1650		35 W	106 W		US $549
Core i7	13790F		2.1	5.2		8 (8)	1.5	4.1	—		33 MB	65 W	219 W	February 2023	CN ¥2999
	13700K		3.4	5.4			2.5	4.2	UHD 770	300–1600	30 MB	125 W	253 W	October 2022	US $409
	13700KF								—						US $384
	13700		2.1	5.2			1.5	4.1	UHD 770	300–1600		65 W	219 W	January 2023
	13700F								—						US $359
	13700T		1.4	4.9			1.0	3.6	UHD 770	300–1600		35 W	106 W		US $384
Core i5	13600K	6 (12)	3.5	5.1			2.6	3.9		300–1500	24 MB	125 W	181 W	October 2022	US $319
	13600KF								—						US $294
	13600		2.7	5.0			2.0	3.7	UHD 770	300–1550		65 W	154 W	January 2023	US $255
	13600T		1.8	4.8			1.3	3.4				35 W	92 W
	13500		2.5				1.8	3.5				65 W	154 W		US $232
	13500T		1.6	4.6			1.2	3.2				35 W	92 W
	13490F		2.5	4.8		4 (4)	1.8	3.5	—			65 W	148 W	February 2023	CN ¥1599
	13400			4.6				3.3	UHD 730	300–1550	20 MB	65 W	154 W	January 2023	US $221
	13400F								—				148 W		US $196
	13400T		1.3	4.4			1.0	3.0	UHD 730	300–1550		35 W	82 W		US $221
Core i3	13100	4 (8)	3.4	4.5		—				300–1500	12 MB	60 W	89 W		US $134
	13100F								—						US $109
	13100T		2.5	4.2					UHD 730	300–1500		35 W	69 W		US $134

Core i (14th gen)

Raptor Lake-S Refresh

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo	TVB		Base	Turbo
Core i9	14900KS	8 (16)	3.2	5.9	6.2	16 (16)	2.4	4.5	UHD 770	300–1650	36 MB	150 W	253 W	March 2024	US $689
	14900K			5.8	6.0			4.4				125 W		October 2023	US $589
	14900KF								—						US $564
	14900		2.0	5.6	5.8		1.5	4.3	UHD 770	300–1650		65 W	219 W	January 2024	US $549
	14900F								—						US $524
	14900T		1.1	5.5	—		0.9	3.7	UHD 770	300–1650		35 W	106 W		US $549
Core i7	14790F		2.1	5.4		8 (8)	1.5	4.2	—			65 W	219 W		China only
	14700K		3.4	5.6		12 (12)	2.5	4.3	UHD 770	300–1600	33 MB	125 W	253 W	October 2023	US $409
	14700KF								—						US $384
	14700		2.1	5.4			1.5	4.2	UHD 770	300–1600		65 W	219 W	January 2024
	14700F								—						US $359
	14700T		1.3	5.2			0.9	3.7	UHD 770	300–1600		35 W	106 W		US $384
Core i5	14600K	6 (12)	3.5	5.3		8 (8)	2.6	4.0		300–1550	24 MB	125 W	181 W	October 2023	US $319
	14600KF								—						US $294
	14600		2.7	5.2			2.0	3.9	UHD 770	300–1550		65 W	154 W	January 2024	US $255
	14600T		1.8	5.1			1.3	3.6				35 W	92 W
	14500		2.6	5.0			1.9	3.7				65 W	154 W		US $232
	14500T		1.7	4.8			1.2	3.4				35 W	92 W
	14490F		2.8	4.9		4 (4)	2.1	3.7	—			65 W	148 W		China only
	14400		2.5	4.7			1.8	3.5	UHD 730	300–1550	20 MB				US $221
	14400F								—						US $196
	14400T		1.5	4.5			1.1	3.2	UHD 730	300–1550		35 W	82 W		US $221
Core i3	14100	4 (8)	3.5	4.7		—				300–1500	12 MB	60 W	110 W		US $134
	14100F								—						US $109
	14100T		2.7	4.4					UHD 730	300–500		35 W	69 W		US $134

Mobile processors

Release timeline

Mobile processors

2009	Nehalem microarchitecture (1st generation)
2010	Westmere microarchitecture (1st generation)
2011	Sandy Bridge microarchitecture (2nd generation)
2012	Ivy Bridge microarchitecture (3rd generation)
2013	Haswell microarchitecture (4th generation)
2014
2015	Broadwell microarchitecture (5th generation)
	Skylake microarchitecture (6th generation)
2016
2017	Kaby Lake microarchitecture (7th/8th generation)
2018	Coffee Lake microarchitecture (8th generation)
2019	Comet Lake microarchitecture (10th generation)
	Ice Lake (10th generation)
2020	Tiger Lake (11th generation)
2021
2022	Alder Lake (12th generation)
2023	Raptor Lake (13th generation)
	Raptor Lake (14th generation)

Core

Yonah

Main article: Yonah (microprocessor)

Model	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Release price (USD)
Core Solo U1300	1.07 GHz	2 MB	533 MT/s	8×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$241
Core Solo U1400	1.2 GHz	2 MB	533 MT/s	9×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$262
Core Solo U1500	1.33 GHz	2 MB	533 MT/s	10×	0.85–1.1 V	5.5 W	Socket 479/FC-μBGA	January 2007	$262
Core Duo U2400	1.07 GHz	2 MB	533 MT/s	8×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$262
Core Duo U2500	1.2 GHz	2 MB	533 MT/s	9×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$289
Core Duo L2300	1.5 GHz	2 MB	667 MT/s	9×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$284
Core Duo L2400	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$316
Core Duo L2500	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	September 2006	$316
Core Solo T1200	1.5 GHz	2 MB	667 MT/s	9×	0.7625–1.3 V	27 W	Socket M	July 2006
Core Solo T1250	1.73 GHz	2 MB	533 MT/s	13×	0.7625–1.3 V	31 W	Socket M
Core Solo T1300	1.67 GHz	2 MB	667 MT/s	10×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	January 2006	$209
Core Solo T1350	1.87 GHz	2 MB	533 MT/s	14×	0.7625–1.3 V	31 W	Socket M	July 2006
Core Solo T1400	1.83 GHz	2 MB	667 MT/s	11×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	May 2006	$209
Core Solo T1500	2 GHz	2 MB	667 MT/s	12×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket M	August 2006
Core Duo T2050	1.6 GHz	2 MB	533 MT/s	12×	0.762–1.3 V	31 W	Socket M	May 2006	$140
Core Duo T2250	1.73 GHz	2 MB	533 MT/s	13×	0.762–1.3 V	31 W	Socket M	May 2006	OEM
Core Duo T2300	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$241
Core Duo T2300E	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M μFCBGA-479 μFCBGA-479	May 2006	$209
Core Duo T2350	1.87 GHz	2 MB	533 MT/s	14×	0.762–1.3 V	31 W	Socket M		OEM
Core Duo T2400	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.3 V	31 W 31 W 27 W 27 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$294
Core Duo T2450	2 GHz	2 MB	533 MT/s	15×	0.762–1.3 V	31 W	Socket M		OEM
Core Duo T2500	2 GHz	2 MB	667 MT/s	12×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$423
Core Duo T2600	2.17 GHz	2 MB	667 MT/s	13×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$637
Core Duo T2700	2.33 GHz	2 MB	667 MT/s	14×	0.762–1.3 V	31 W	Socket M Socket 479/FC-μBGA	June 2006	$637

Core 2

Main article: Intel Core 2

Inside of old Sony VAIO laptop (VGN-C140G)

"Merom-L" (65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 81 mm²
• Steppings: A1

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
ultra-low voltage
Core 2 Solo ULV U2100	SLAGM (A1)	1	1.07 GHz	1 MB	533 MT/s	8×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0041M	$241
Core 2 Solo ULV U2200	SLAGL (A1)	1	1.2 GHz	1 MB	533 MT/s	9×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0091M	$262

"Merom", "Merom-2M" (standard-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
• Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 143 mm² (Merom), 111 mm² (Merom-2M)
• Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
• All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo T5200	SL9VP (B2)	2	1.6 GHz	2 MB	533 MT/s	12×	0.95–1.175 V	34 W	Socket M	October 2006	LF80537GE0252M	OEM
Core 2 Duo T5250	SLA9S (M0)	2	1.5 GHz	2 MB	667 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0212M	OEM
Core 2 Duo T5270	SLALK (M0)	2	1.4 GHz	2 MB	800 MT/s	7×	0.95–1.175 V	35 W	Socket P	October 2007	LF80537GG0172M	OEM
Core 2 Duo T5300	SL9WE (L2)	2	1.73 GHz	2 MB	533 MT/s	13×	0.95–1.175 V	34 W	Socket M	Q1 2007	LF80537GE0302M	OEM
Core 2 Duo T5450	SLA4F (M0)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0282MT	OEM
Core 2 Duo T5470	SLAEB (M0)	2	1.6 GHz	2 MB	800 MT/s	8×	0.95–1.175 V	35 W	Socket P	July 2007	LF80537GG0252M	OEM
Core 2 Duo T5500	SL9SH (B2) SLGFK (G2) SL9U4 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	Socket M	August 28, 2006	LF80537GF0282M	$209
Core 2 Duo T5500	SL9SQ (B2) SL9U8 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0282M	$209
Core 2 Duo T5550	SLA4E (M0)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0342MT	OEM
Core 2 Duo T5600	SL9SG (B2) SL9U3 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0342M	$241
Core 2 Duo T5600	SL9SP (B2) SL9U7 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0342M	$241
Core 2 Duo T5670	SLAJ5 (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2008	LF80537GG0332MN	OEM
Core 2 Duo T5750	SLA4D (M0)	2	2 GHz	2 MB	667 MT/s	12×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0412M	OEM
Core 2 Duo T5800	SLB6E (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GG041F	OEM
Core 2 Duo T5850	SLA4C (M0)	2	2.17 GHz	2 MB	667 MT/s	13×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GF0482M	OEM
Core 2 Duo T5870	SLAZR (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	2008	LF80537GG0412MN	OEM
Core 2 Duo T5900	SLB6D (M0)	2	2.2 GHz	2 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	July 2008	LF80537GG049F	OEM
Core 2 Duo T7100	SLA4A (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0332M	$209
Core 2 Duo T7100	SLA3U (M1)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0332M	$209
Core 2 Duo T7200	SL9SF (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0414M	$294
Core 2 Duo T7200	SL9SL (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0414M	$294
Core 2 Duo T7250	SLA49 (M0) SLAXH (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0412M	$290
Core 2 Duo T7250	SLA3T (M1)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0412M	$290
Core 2 Duo T7300	SLAMD (G0) SLA45 (E1)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0414M LF80537GG0414M	$241
Core 2 Duo T7300	SLA3P (E1) SLAMF (G0)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0414M	$241
Core 2 Duo T7400	SL9SE (B2) SLGFJ (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0484M	$423
Core 2 Duo T7400	SL9SK (B2) SLGFV (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0484M	$423
Core 2 Duo T7500	SLA44 (E1) SLAF8 (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0494M	$316
Core 2 Duo T7500	SLA3N (E1) SLADM (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0494M	$316
Core 2 Duo T7600	SL9SD (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0534M	$637
Core 2 Duo T7600	SL9SJ (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0534M	$637
Core 2 Duo T7600G	SL9U5 (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	December 2006	LF80537GF0534MU
Core 2 Duo T7700	SLA43 (E1) SLAF7 (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0564M	$530
Core 2 Duo T7700	SLA3M (E1) SLADL (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0564M	$530
Core 2 Duo T7800	SLAF6 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0644ML	$530
Core 2 Duo T7800	SLA75 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0644M	$530

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
• Die size: 143 mm²
• Steppings: B2, E1, G0, G2

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SL7100	SLAJD SLAT4	2	1.2 GHz	4 MB	800 MT/s	6×		12 W	μFC-BGA 956		SY80537LG0094M	OEM
Core 2 Duo L7200	SL9SN (B2)	2	1.33 GHz	4 MB	667 MT/s	8×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0144M	$284
Core 2 Duo L7300	SLA3S (E1)	2	1.4 GHz	4 MB	800 MT/s	7×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0174M	$284
Core 2 Duo L7400	SL9SM (B2) SLGFX (G2)	2	1.5 GHz	4 MB	667 MT/s	9×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0214M	$316
Core 2 Duo L7500	SLA3R (E1) SLAET (G0)	2	1.6 GHz	4 MB	800 MT/s	8×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0254M	$316
Core 2 Duo SP7500	SLAT2 SLAEV	2	1.6 GHz	4 MB	800 MT/s	8×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0254M	OEM
Core 2 Duo L7700	SLAES (G0)	2	1.8 GHz	4 MB	800 MT/s	9×	0.9–1.1 V	17 W	FCBGA6	September 2007	LE80537LG0334M	$316
Core 2 Duo SP7700	SLALQ SLALR SLASZ	2	1.8 GHz	4 MB	800 MT/s	9×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0334M SY80537GG0334ML	OEM

"Merom-2M" (ultra-low-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 111 mm²
• Steppings: L2, M0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo U7500	SLA2V (L2) SLAUT (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0042M	$262
Core 2 Duo U7500	SLV3X (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0042ML	$262
Core 2 Duo U7600	SLA2U (L2) SLAUS (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0092M	$289
Core 2 Duo U7600	SLV3W (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	April 2007	LE80537UE0092ML	$289
Core 2 Duo U7700	SLA6X (L2) SLAUR (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	December 2007	LE80537UE0142M	$289
Core 2 Duo U7700	SLV3V (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0142ML	$289

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
• Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
• Die size: 143 mm²
• Steppings: E1, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme X7800	SLA6Z (E1)	2	2.6 GHz	4 MB	800 MT/s	13×	1.0375–1.3 V	44 W	Socket P	July 2007	LF80537GG0644M	$851
Core 2 Extreme X7900	SLA33 (E1) SLAF4 (G0)	2	2.8 GHz	4 MB	800 MT/s	14×	1.0375–1.3 V	44 W	Socket P	August 2007	LF80537GG0724M	$851

"Penryn-L" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 82 mm²
• 228 million transistors
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Small Form Factor, ultra-low voltage
Core 2 Solo SU3300	SLGAR (M0) SLGAJ (R0)	1	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	5.5 W	μFC-BGA 956	May 2008	AV80585UG0093M	$262
Core 2 Solo SU3500	SLGFM (R0)	1	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	5.5 W	μFC-BGA 956	Q2 2009	AV80585UG0173M	$262

"Penryn" (Apple iMac specific, 45 nm)

• Die size: 107 mm²
• The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E8135	SLAQA (C0)	2	2.4 GHz	6 MB	1066 MT/s	9×		44 W	Socket P	April 2008	FF80576E8135 FF80576GH0676M
Core 2 Duo E8135	SLG8W (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		44 W	Socket P	March 2009	AW80576GH0676M AW80576E8135
Core 2 Duo E8135	SLGED (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		35 W	Socket P	March 2009	AW80576GH0676M
Core 2 Duo E8235	SLAQB (C0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×		44 W	Socket P	April 2008	FF80576GH0726M
Core 2 Duo E8335	SLAQC (C0)	2	2.93 GHz	6 MB	1066 MT/s	11×		44 W	Socket P	April 2008	FF80576GH0776M
Core 2 Duo E8335	SLGEB (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.0500–1.2250 V	35 W	Socket P	March 2009	AW80576GH0776M
Core 2 Duo E8435	SLAQD (C0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.0500–1.2375 V	55 W	Socket P	April 2008	FF80576GH0836M
Core 2 Duo E8435	SLGEA (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×		44 W	Socket P	March 2009	AW80576GH0836M

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
• T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
• All T9xxx models support Trusted Execution Technology (TXT)
• T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo T6400	SLGJ4 (R0)	2	2 GHz	2 MB	800 MT/s	10×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0412MA	OEM
Core 2 Duo T6500	SLGF4 (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0452ML AW80577GG0452MA	OEM
Core 2 Duo T6570	SLGLL (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0452MH	OEM
Core 2 Duo T6600	SLGJ9 (R0) SLGF5 (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0492MA AW80577GG0492ML	OEM
Core 2 Duo T6670	SLGLK (R0) SLGLJ (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0492MH	OEM
Core 2 Duo T6900	SLGHZ (?)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MA	OEM
Core 2 Duo T6970	SLGLJ (R0)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MH	OEM
Core 2 Duo T8100	SLAP9 (M0) SLAVJ (M0) SLAYP (M0) SLAYZ (C0) SLAUU (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80577GG0453M (M0) FF80577GG0453MN FF80576GG0453M (C0) BX80577T8100	$209
Core 2 Duo T8100	SLAPS (M0) SLAXG (M0) SLAPT (C0) SLAZD (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0453M (M0) EC80576GG0453M (C0)	$209
Core 2 Duo T8300	SLAPA (M0) SLAYQ (M0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	Socket P	January 2008	FF80577GG0563M BX80577T8300	$241
Core 2 Duo T8300	SLAPR (M0) SLAPU (C0) SLAZC (C0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0563M (M0) EC80576GG0563M (C0)	$241
Core 2 Duo T9300	SLAQG (C0) SLAYY (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0606M	$316
Core 2 Duo T9300	SLAPV (C0) SLAZB (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0606M	$316
Core 2 Duo T9400	SLB46 (C0) SLB4D (C0) SLGE5 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0616M	$316
Core 2 Duo T9400	SL3BX (C0) SLGEK (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0616M	$316
Core 2 Duo T9500	SLAQH (C0) SLAYX (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0646M	$530
Core 2 Duo T9500	SLAPW (C0) SLAZA (C0) SLB49 (C0) SLB4A (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0646M AV80576SH0616M	$530
Core 2 Duo T9550	SLGE4 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0676MG	$316
Core 2 Duo T9550	SLGEL (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0676MG	$316
Core 2 Duo T9600	SLB47 (C0) SLG8N (C0) SLG9F (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0726M	$530
Core 2 Duo T9600	SLB43 (C0) SLGEM (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0726M	$530
Core 2 Duo T9800	SLGES (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0776MG	$530
Core 2 Duo T9800	SLGEP (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0776MG	$530
Core 2 Duo T9900	SLGEE (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	Socket P	April 2009	AW80576GH0836MG	$530
Core 2 Duo T9900	SLGKH (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	FCBGA6	April 2009	AV80576GH0836MG	$530

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Select Apple subsets of P7000 series processors support Intel VT-x.
• Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Package size: 35 mm × 35 mm
• Transistors: 410 million
• Steppings: (Core microarchitecture 45nm steppings)
  • C0, E0 (Penryn)
  • M0, R0 (Penryn-3M)
  • stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
  • stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo P7350	SLB44 (C0) SLB53 (M0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	Mid 2008	AW80576GH0413M AW80577SH0413M	OEM
Core 2 Duo P7350	SLG8E (C0) SLGE3 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	FC-BGA478	Mid 2008		OEM
Core 2 Duo P7370	SLG8X (R0) SLGF9 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0413M AW80577SH0413ML	OEM
Core 2 Duo P7450	SLB45 (C0) SLGF7 (R0) SLB54 (M0) SLB56 (M0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0463M AW80576GH0463M (C0)	OEM
Core 2 Duo P7450	SLGFF (C0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	FC-BGA478	January 2009	AW80577P7450M (C0)	OEM
Core 2 Duo P7550	SLGF8 (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 2009	AW80577SH0513MA	OEM
Core 2 Duo P7570	SLGLW (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	Q3 2009	AW80577SH0513ML	OEM
Core 2 Duo P8400	SLB3R (M0) SLB3Q (M0) SLB52 (M0) SLG8Z (M0) SLGCC (R0) SLGCQ (R0) SLGCF (R0) SLGFC (R0) SLGCL (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 13, 2008	AW80577SH0513M AW80577SH0513MN BX80577P8400	$209
Core 2 Duo P8400	SLB4M (M0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0513M	$209
Core 2 Duo P8600	SLB3S (M0) SLGA4 (M0) SLGFD (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	Socket P	June 2008	AW80577SH0563M BX80577P8600	$241
Core 2 Duo P8600	SLB4N (M0) SLGDZ (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0563M	$241
Core 2 Duo P8700	SLGFE (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	Socket P	December 2008	AW80577SH0613MG BX80577P8700	$241
Core 2 Duo P8700	SLGFG (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	FC-BGA478	December 2008	AV80577SH0613MG	$241
Core 2 Duo P8800	SLGLR (R0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	Socket P	Q2 2009	AW80577SH0673MG BX80577P8800	$241
Core 2 Duo P8800	SLGLA (E0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	FC-BGA478	Q2 2009	AV80577SH0673MG	$241
Core 2 Duo P9500	SLB4E (C0) SLGE8 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.05–1.162 V	25 W	Socket P	July 2008	AW80576SH0616M AV80576SH0616M	$348
Core 2 Duo P9600	SLGE6 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.05–1.212 V	25 W	Socket P	December 2008	AW80576SH0676MG	$348
Core 2 Duo P9700	SLGQS (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.012–1.175 V	28 W	Socket P	June 2009	AW80576SH0726MG	$348

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SP9300	SLB63 (C0)	2	2.27 GHz	6 MB	1066 MT/s	8.5×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0516M	$284
Core 2 Duo SP9400	SLB64 (C0) SLGHG (C0) SLGAA (E0)	2	2.4 GHz	6 MB	1066 MT/s	9×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0566M	$284
Core 2 Duo SP9600	SLGER (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	0.900–1.225 V	25 W	μFC-BGA 956	Q1 2009	AV80576SH0516M AV80576SH0616M	$316

"Penryn" (low-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SL9300	SLB65 (C0) SLGHC (C0) SLGAG (E0)	2	1.6 GHz	6 MB	1066 MT/s	6×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0256M	$284
Core 2 Duo SL9380	SLGA2 (C0) SLGAD (E0)	2	1.8 GHz	6 MB	800 MT/s	9×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LG0336M	$316
Core 2 Duo SL9400	SLB66 (C0) SLGHD (C0) SLGAB (E0)	2	1.87 GHz	6 MB	1066 MT/s	7×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0366M	$316
Core 2 Duo SL9600	SLGEQ (E0)	2	2.13 GHz	6 MB	1066 MT/s	8×	1.050–1.150 V	17 W	μFC-BGA 956	Q1'09	AV80576LH0466M	$316

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SU7300	SLGS6 (R0) SLGYV (R0)	2	1.3 GHz	3 MB	800 MT/s	6.5×	1.05–1.15 V	10 W	μFC-BGA 956	September 2009	AV80577UG0133M AV80577UG0133ML	$289
Core 2 Duo SU9300	SLB5Q (M0) SLGAL (R0)	2	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0093M	$262
Core 2 Duo SU9400	SLB5V (M0) SLGHN (M0) SLGAK (R0)	2	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0173M	$289
Core 2 Duo SU9600	SLGEX (R0) SLGFN (R0)	2	1.6 GHz	3 MB	800 MT/s	8×	1.05–1.15 V	10 W	μFC-BGA 956	Q1 2009	AV80577UG0253M	$289

"Penryn XE" (45 nm)

• These models feature an unlocked clock multiplier
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
• Die size: 107 mm²
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme X9000	SLAQJ (C0) SLAZ3 (C0)	2	2.8 GHz	6 MB	800 MT/s	14×	1.062–1.150 V	44 W	Socket P	January 2008	FF80576ZG0726M	$851
Core 2 Extreme X9100	SLB48 (C0) SLG8M (C0) SLGE7 (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.062–1.150 V	44 W	Socket P	July 2008	AW80576GH0836M	$851

"Penryn QC" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Die size: 2 × 107 mm²
• Steppings: E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q9000	SLGEJ (E0)	4	2 GHz	2 × 3 MB	1066 MT/s	7.5×	1.050–1.175 V	45 W	Socket P	December 2008	AW80581GH0416M BX80581Q9000	$348
Core 2 Quad Q9100	SLB5G (E0)	4	2.27 GHz	2 × 6 MB	1066 MT/s	8.5×	1.050–1.175 V	45 W	Socket P	August 2008	AW80581GH051003	$851

"Penryn QC XE" (45 nm)

• This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Package size: 35 mm × 35 mm
• Die size: 2 × 107 mm²
• Steppings: E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme QX9300	SLB5J (E0)	4	2.53 GHz	2 × 6 MiB	1066 MT/s	9.5×	1.050–1.175 V	45 W	Socket P	August 2008	AW80581ZH061003	$1038

Core i (1st gen)

Clarksfield

Common features:

• Socket: G1.
• All the CPUs support dual-channel DDR3-1333 RAM.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• XM-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date
			Base	Turbo
Core i7	940XM	4 (8)	2.13	3.33	8 MB	55 W	June 2010
	920XM		2.00	3.20			September 2009
	840QM		1.86			45 W	June 2010
	820QM		1.73	3.06			September 2009
	740QM			2.93	6 MB		June 2010
	720QM		1.60	2.80			September 2009

Arrandale

Common features:

• Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
• All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	680UM	2 (4)	1.46	2.53	HD Graphics	166–500	4 MB	18 W	September 2010
	660LM		2.26	3.06		266–566		25 W
	660UM		1.33	2.40		166–500		18 W	May 2010
	640M		2.80	3.46		500–766		35 W	September 2010
	640LM		2.13	2.93		266–566		25 W	January 2010
	640UM		1.20	2.27		166–500		18 W
	620M		2.66	3.33		500–766		35 W
	620LM		2.00	2.80		266–566		25 W
	620UM		1.06	2.13		166–500		18 W
Core i5	580M		2.66	3.33		500–766	3 MB	35 W	September 2010
	560M			3.20
	560UM		1.33	2.13		166–500		18 W
	540M		2.53	3.07		500–766		35 W	January 2010
	540UM		1.20	2.00		166–500		18 W	May 2010
	520M		2.40	2.93		500–766		35 W	January 2010
	520UM		1.07	1.87		166–500		18 W
	480M		2.66	2.93		500–766		35 W	January 2011
	470UM		1.33	1.86		166–500		18 W	October 2010
	460M		2.53	2.80		500–766		35 W	September 2010
	450M		2.40	2.66					June 2010
	430M		2.26	2.53					January 2010
	430UM		1.20	1.73		166–500		18 W	May 2010
Core i3	390M		2.66	—		500–667		35 W	January 2011
	380M		2.53						September 2010
	380UM		1.33			166–500		18 W	October 2010
	370M		2.40			500–667		35 W	June 2010
	350M		2.26						January 2010
	330M		2.13
	330UM		1.20			166–500		18 W	May 2010

Core i (2nd gen)

Sandy Bridge-M

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	2960XM	4 (8)	2.7	3.7	HD 3000	650–1300	8 MB	55 W	September 2011
	2920XM		2.5	3.5					January 2011
	2860QM			3.6				45 W	September 2011
	2820QM		2.3	3.4					January 2011
	2760QM		2.4	3.5			6 MB		September 2011
	2720QM		2.2	3.3					January 2011
	2675QM			3.1		650–1200			October 2011
	2670QM					650–1100
	2635QM		2.0	2.9		650–1200			January 2011
	2630QM					650–1100
	2677M	2 (4)	1.8	2.9		350–1200	4 MB	17 W	June 2011
	2657M		1.6	2.7		350–1000			February 2011
	2640M		2.8	3.5		650–1300		35 W	September 2011
	2649M		2.3	3.2		500–1100		25 W	February 2011
	2637M		1.7	2.8		350–1200		17 W	June 2011
	2620M		2.7	3.4		650–1300		35 W	February 2011
	2629M		2.1	3.0		500–1100		25 W
	2617M		1.5	2.6		350–950		17 W
Core i5	2557M		1.7	2.7		350–1200	3 MB		June 2011
	2540M		2.6	3.3		650–1300		35 W	February 2011
	2537M		1.4	2.3		350–900		17 W
	2520M		2.5	3.2		650–1300		35 W
	2467M		1.6	2.3		350–1150		17 W	June 2011
	2450M		2.5	3.1		650–1300		35 W	January 2012
	2435M		2.4	3.0					September 2011
	2430M					650–1200			October 2011
	2415M		2.3	2.9		650–1300			Q1 2011
	2410M					650–1200			February 2011
Core i3	2370M		2.4	—		650–1150			January 2012
	2377M		1.5			350–1000		17 W	September 2012
	2375M								Q1 2013
	2367M		1.4						October 2011
	2365M								September 2012
	2350M		2.3			650–1150		35 W	October 2011
	2357M		1.3			350–950		17 W	June 2011
	2348M		2.3			650–1150		35 W	January 2013
	2332M		2.2			650–1100			September 2011
	2330M								June 2011
	2328M								September 2012
	2312M		2.1						Q2 2011
	2310M								February 2011
	2308M								Q3 2012

Core i (3rd gen)

Ivy Bridge

Intel i5 3230M die shot

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	3940XM	4 (8)	3.0	3.9	HD 4000	650–1350	8 MB	55 W	September 2012
	3920XM		2.9	3.8		650–1300			April 2012
	3840QM		2.8					45 W	September 2012
	3820QM		2.7	3.7		650–1250			April 2012
	3740QM					650–1300	6 MB		September 2012
	3720QM		2.6	3.6		650–1250			April 2012
	3635QM		2.4	3.4		650–1200			September 2012
	3630QM					650–1150
	3632QM		2.2	3.2				35 W	October 2012
	3615QM		2.3	3.3		650–1200		45 W	April 2012
	3610QM					650–1100
	3612QM		2.1	3.1				35 W
	3687U	2 (4)	2.1	3.3		350–1200	4 MB	17 W	January 2013
	3689Y		1.5	2.6		350–850		13 W
	3667U		2.0	3.2		350–1150		17 W	June 2012
	3540M		3.0	3.7		650–1300		35 W	January 2013
	3537U		2.0	3.1		350–1200		17 W
	3520M		2.9	3.6		650–1250		35 W	June 2012
	3517U		1.9	3.0		350–1150		17 W
Core i5	3437U			2.9		650–1200	3 MB		January 2013
	3439Y		1.5	2.3		350–850		13 W
	3427U		1.8	2.8		350–1150		17 W	June 2012
	3380M		2.9	3.6		650–1250		35 W	January 2013
	3360M		2.8	3.5		650–1200			June 2012
	3340M		2.7	3.4		650–1250			January 2013
	3337U		1.8	2.7		350–1100		17 W
	3339Y		1.5	2.0		350–850		13 W
	3320M		2.6	3.3		650–1200		35 W	June 2012
	3317U		1.7	2.6		350–1050		17 W
	3230M		2.6	3.2		650–1100		35 W	January 2013
	3210M		2.5	3.1					June 2012
Core i3	3227U		1.9	—		350–1100		17 W	January 2013
	3229Y		1.4			350–850		13 W
	3217U		1.8			350–1050		17 W	June 2012
	3130M		2.6			650–1100		35 W	January 2013
	3120M		2.5						September 2012
	3110M		2.4			650–1000			June 2012

Core i (4th gen)

Haswell-MB

Common features:

• Socket: G3.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• MX-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4940MX	4 (8)	3.1	4.0	HD 4600	400–1350	8 MB	57 W	February 2014
	4930MX		3.0	3.9					June 2013
	4910MQ		2.9			400–1300		47 W	February 2014
	4900MQ		2.8	3.8					June 2013
	4810MQ						6 MB		February 2014
	4800MQ		2.7	3.7					June 2013
	4710MQ		2.5	3.5		400–1150			April 2014
	4712MQ		2.3	3.3				37 W
	4700MQ		2.4	3.4				47 W	June 2013
	4702MQ		2.2	3.2				37 W
	4610M	2 (4)	3.0	3.7		400–1300	4 MB		February 2014
	4600M		2.9	3.6					September 2013
Core i5	4340M					400–1250	3 MB		February 2014
	4330M		2.8	3.5					September 2013
	4310M		2.7	3.4					February 2014
	4300M		2.6	3.3					September 2013
	4210M			3.2		400–1150			April 2014
	4200M		2.5	3.1					September 2013
Core i3	4110M		2.6	—		400–1100			April 2014
	4100M		2.5						September 2013
	4010M								Q3 2014
	4000M		2.4						September 2013

Haswell-ULT

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4650U	2 (4)	1.7	3.3	HD 5000	200–1100	4 MB	15 W	June 2013
	4600U		2.1		HD 4400				September 2013
	4578U		3.0	3.5	Iris 5100	200–1200		28 W	July 2014
	4558U		2.8	3.3					June 2013
	4550U		1.5	3.0	HD 5000	200–1100		15 W
	4510U		2.0	3.1	HD 4400				April 2014
	4500U		1.8	3.0					June 2013
Core i5	4360U		1.5		HD 5000		3 MB		February 2014
	4350U		1.4	2.9					June 2013
	4310U		2.0	3.0	HD 4400				February 2014
	4308U		2.8	3.3	Iris 5100	200–1200		28 W	July 2014
	4300U		1.9	2.9	HD 4400	200–1100		15 W	September 2013
	4288U		2.6	3.1	Iris 5100	200–1200		28 W	June 2013
	4278U					200–1100			July 2014
	4260U		1.4	2.7	HD 5000	200–1000		15 W	April 2014
	4258U		2.4	2.9	Iris 5100	200–1100		28 W	June 2013
	4250U		1.3	2.6	HD 5000	200–1000		15 W
	4210U		1.7	2.7	HD 4400				April 2014
	4200U		1.6	2.6					June 2013
Core i3	4158U		2.0	—	Iris 5100	200–1100		28 W
	4120U				HD 4400	200–1000		15 W	April 2014
	4100U		1.8						June 2013
	4030U		1.9						April 2014
	4025U					200–950
	4010U		1.7			200–1000			June 2013
	4005U					200–950			September 2013

Haswell-ULX

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4610Y	2 (4)	1.7	2.9	HD 4200	200–850	4 MB	11.5 W	September 2013
Core i5	4302Y		1.6	2.3			3 MB
	4300Y
	4220Y			2.0					April 2014
	4210Y		1.5	1.9					September 2013
	4202Y		1.6	2.0
	4200Y		1.4	1.9					June 2013
Core i3	4030Y		1.6	—					April 2014
	4020Y		1.5						September 2013
	4012Y
	4010Y		1.3						June 2013

Haswell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 22 nm.
• i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4980HQ	4 (8)	2.8	4.0	Iris Pro 5200	200–1300	6 MB	47 W	July 2014
	4960HQ		2.6	3.8					September 2013
	4950HQ		2.4	3.6					June 2013
	4870HQ		2.5	3.7		200–1200			July 2014
	4860HQ		2.4	3.6					February 2014
	4850HQ		2.3	3.5					June 2013
	4770HQ		2.2	3.4					July 2014
	4760HQ		2.1	3.3					April 2014
	4750HQ		2.0	3.2					June 2013
	4720HQ		2.6	3.6	HD 4600	400–1200			January 2015
	4722HQ		2.4	3.4		400–1150		37 W
	4710HQ		2.5	3.5		400–1200		47 W	April 2014
	4712HQ		2.3	3.3		400–1150		37 W
	4700HQ		2.4	3.4		400–1200		47 W	June 2013
	4702HQ		2.2	3.2		400–1150		37 W
Core i5	4210H	2 (4)	2.9	3.5			3 MB	47 W	July 2014
	4200H		2.8	3.4					September 2013

Core i (5th gen)

Broadwell-U

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5650U	2 (4)	2.2	3.2	HD 6000	300–1000	4 MB	15 W	January 2015
	5600U		2.6		HD 5500	300–950
	5557U		3.1	3.4	Iris 6100	300–1100		28 W
	5550U		2.0	3.0	HD 6000	300–1000		15 W
	5500U		2.4		HD 5500	300–950
Core i5	5350U		1.8	2.9	HD 6000	300–1000	3 MB
	5300U		2.3		HD 5500	300–900
	5287U		2.9	3.3	Iris 6100	300–1100		28 W
	5257U		2.7	3.1		300–1050
	5250U		1.6	2.7	HD 6000	300–1000		15 W
	5200U		2.2		HD 5500	300–900
Core i3	5157U		2.5	—	Iris 6100	300–1000		28 W
	5020U		2.2		HD 5500	300–900		15 W	March 2015
	5015U		2.1			300–850
	5010U					300–900			January 2015
	5005U		2.0			300–850

Broadwell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5950HQ	4 (8)	2.9	3.7	Iris Pro 6200	300–1150	6 MB	47 W	June 2015
	5850HQ		2.7	3.6		300–1100
	5750HQ		2.5	3.4		300–1050
	5700HQ		2.7	3.5	HD 5600
Core i5	5350H	2 (4)	3.1		Iris Pro 6200		4 MB

Core M (5th gen)

Broadwell-Y

Common features:

• Socket: BGA 1234.
• All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core M	5Y71	2 (4)	1.2	2.9	HD 5300	300–900	4 MB	4.5 W	October 2014
	5Y70		1.1	2.6		100–850			September 2014
	5Y51					300–900			October 2014
	5Y31		0.9	2.4		300–850
	5Y10c		0.8	2.0		300–800
	5Y10a					100–800			September 2014
	5Y10

Core i (6th gen)

Skylake-U

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6660U	2 (4)	2.4	3.4	Iris 540	300–1050	4 MB	15 W	March 2016
	6650U		2.2						September 2015
	6600U		2.6		HD 520
	6567U		3.3	3.6	Iris 550	300–1100		28 W
	6560U		2.2	3.2	Iris 540	300–1050		15 W
	6500U		2.5	3.1	HD 520
	6498DU				HD 510				December 2015
Core i5	6360U		2.0		Iris 540	300–1000	3 MB		September 2015
	6300U		2.4	3.0	HD 520
	6287U		3.1	3.5	Iris 550	300–1100	4 MB	28 W
	6267U		2.9	3.3		300–1050
	6260U		1.8	2.9	Iris 540	300–950		15 W
	6200U		2.3	2.8	HD 520	300–1000	3 MB
	6198DU				HD 510				December 2015
Core i3	6167U		2.7	—	Iris 550			28 W
	6157U		2.4						September 2016
	6100U		2.3		HD 520			15 W	September 2015
	6006U		2.0			300–900			November 2016

Skylake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6970HQ	4 (8)	2.8	3.7	Iris Pro 580	350–1050	8 MB	45 W	January 2016
	6920HQ		2.9	3.8	HD 530				September 2015
	6870HQ		2.7	3.6	Iris Pro 580	350–1000			January 2016
	6820HQ				HD 530	350–1050			September 2015
	6820HK
	6770HQ		2.6	3.5	Iris Pro 580	350–950	6 MB		January 2016
	6700HQ				HD 530	350–1050			September 2015
Core i5	6440HQ	4 (4)				350–950
	6350HQ		2.3	3.2	Iris Pro 580	350–900			February 2016
	6300HQ				HD 530	350–950			September 2015
Core i3	6100H	2 (4)	2.7	—		350–900	3 MB	35 W

Core M (6th gen)

Skylake-Y

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m7	6Y75	2 (4)	1.2	3.1	HD 515	300–1000	4 MB	4.5 W	September 2015
Core m5	6Y57		1.1	2.8		300–900
	6Y54			2.7
Core m3	6Y30		0.9	2.2		300–850

Core i (7th gen)

Kaby Lake-U

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7660U	2 (4)	2.5	4.0	Iris Plus 640	300–1100	4 MB	15 W	January 2017
	7600U		2.8	3.9	HD 620	300–1150
	7567U		3.5	4.0	Iris Plus 650			28 W
	7560U		2.4	3.8	Iris Plus 640	300–1050		15 W
	7500U		2.7	3.5	HD 620				September 2016
Core i5	7360U		2.3	3.6	Iris Plus 640	300–1000			January 2017
	7300U		2.6	3.5	HD 620	300–1100	3 MB
	7287U		3.3	3.7	Iris Plus 650		4 MB	28 W
	7267U		3.1	3.5		300–1050
	7260U		2.2	3.4	Iris Plus 640	300–950		15 W
	7200U		2.5	3.1	HD 620	300–1000	3 MB		September 2016
Core i3	7167U		2.8	—	Iris Plus 650			28 W	January 2017
	7130U		2.7		HD 620			15 W	June 2017
	7100U		2.4						September 2016
	7020U		2.3						Q2 2018

Kaby Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7920HQ	4 (8)	3.1	4.1	HD 630	350–1100	8 MB	45 W	January 2017
	7820HK		2.9	3.9
	7820HQ
	7700HQ		2.8	3.8			6 MB
Core i5	7440HQ	4 (4)				300–1000
	7300HQ		2.5	3.5
Core i3	7100H	2 (4)	3.0	—		300–950	3 MB	35 W

Kaby Lake-Y

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7Y75	2 (4)	1.3	3.6	HD 615	300–1050	4 MB	4.5 W	September 2016
Core i5	7Y57		1.2	3.3		300–950			January 2017
	7Y54			3.2					September 2016

Core M (7th gen)

Kaby Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m3	7Y32	2 (4)	1.1	3.0	HD 615	300–900	4 MB	4.5 W	April 2017
	7Y30		1.0	2.6					September 2016

Core i (8th gen)

Coffee Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8569U	4 (8)	2.8	4.7	Iris Plus 655	300–1200	8 MB	28 W	May 2019
	8559U		2.7	4.5					April 2019
	8557U		1.7		Iris Plus 645	300–1150		15 W	July 2019
Core i5	8279U		2.4	4.1	Iris Plus 655		6 MB	28 W	May 2019
	8269U		2.6	4.2		300–1100			April 2018
	8260U		1.6	3.9	UHD 620			15 W	Q4 2019
	8259U		2.3	3.8	Iris Plus 655	300–1050		28 W	April 2018
	8257U		1.4	3.9	Iris Plus 645			15 W	July 2019
Core i3	8140U	2 (4)	2.1		UHD 620	300–1000	4 MB	15 W	Q4 2019
	8109U		3.0	3.6	Iris Plus 655	300–1050		28 W	April 2018

Coffee Lake-H

For the 9th generation refresh, see section § Coffee Lake-H (refresh) below.

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	8950HK	6 (12)	2.9	4.8	UHD 630	350–1200	12 MB	45 W	April 2018
Core i7	8850H		2.6	4.3		350–1150	9 MB
	8750H		2.2	4.1		350–1100
Core i5	8400H	4 (8)	2.5	4.2			8 MB
	8300H		2.3	4.0		350–1000
Core i3	8100H	4 (4)	3.0	—			6 MB		July 2018

Coffee Lake-B

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8700B	6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W	April 2018
Core i5	8500B	6 (6)	3.0	4.1		350–1100	9 MB
	8400B		2.8	4.0		350–1050
Core i3	8100B	4 (4)	3.6	—			6 MB		Q3 2018

Kaby Lake Refresh

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8650U	4 (8)	1.9	4.2	UHD 620	300–1150	8 MB	15 W	August 2017
	8550U		1.8	4.0
Core i5	8350U		1.7	3.6		300–1100	6 MB
	8250U		1.6	3.4
Core i3	8130U	2 (4)	2.2			300–1000	4 MB		February 2018

Kaby Lake-G

Common features:

• Socket: BGA 2270.
• All the CPUs support dual-channel DDR4-2400 RAM.
• All CPU models provide 8 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Embedded dGPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)	Model	Clock (MHz)
Core i7	8809G	4 (8)	3.1	4.2	HD 630	350–1100	RX Vega M GH	1063–1190	8 MB	100 W	February 2018
	8709G			4.1
	8706G						RX Vega M GL	931–1011		65 W
	8705G
Core i5	8305G		2.8	3.2		350–1000			6 MB

Amber Lake-Y

For the Core m3 models, see section § Core M (8th gen) § Amber Lake-Y below. For the 10th generation series, see section § Amber Lake-Y (10xxx) below.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8500Y	2 (4)	1.5	4.2	UHD 615	300–1050	4 MB	5 W	August 2018
Core i5	8310Y		1.6	3.9	UHD 617			7 W	Q1 2019
	8210Y			3.6					October 2018
	8200Y		1.3	3.9	UHD 615	300–950		5 W	August 2018

Whiskey Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8665U	4 (8)	1.9	4.8	UHD 620	300–1150	8 MB	15 W	April 2019
	8565U		1.8	4.6					August 2018
Core i5	8365U		1.6	4.1		300–1100	6 MB		April 2019
	8265U			3.9					August 2018
Core i3	8145U	2 (4)	2.1			300–1000	4 MB

Cannon Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i3	8121U	2 (4)	2.2	3.2	—		4 MB	15 W	May 2018

Core M (8th gen)

Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m3	8100Y	2 (4)	1.1	3.4	UHD 615	300–900	4 MB	5 W	August 2018

Core i (9th gen)

Coffee Lake-H (refresh)

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	9980HK	8 (16)	2.4	5.0	UHD 630	350–1250	16 MB	45 W	April 2019
	9880H		2.3	4.8		350–1200
Core i7	9850H	6 (12)	2.6	4.6		350–1150	12 MB
	9750H			4.5
	9750HF				—
Core i5	9400H	4 (8)	2.5	4.3	UHD 630	350–1100	8 MB
	9300H		2.4	4.1		350–1050
	9300HF				—

Core i (10th gen)

Comet Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10810U	6 (12)	1.1	4.7	UHD 620	300–1150	12 MB	15 W	May 2020
	10710U								August 2019
	10610U	4 (8)	1.8	4.9			8 MB		May 2020
	10510U								August 2019
Core i5	10310U		1.7	4.4			6 MB		May 2020
	10210U		1.6	4.2		300–1100			August 2019
Core i3	10110U	2 (4)	2.1	4.1		300–1000	4 MB

Comet Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	TVB	Model	Clock (MHz)
Core i9	10980HK	8 (16)	2.4	5.1	5.3	UHD 630	350–1250	16 MB	45 W	April 2020
	10885H									May 2020
Core i7	10875H		2.3	4.9	5.1		350–1200			April 2020
	10870H		2.2	4.8	5.0					September 2020
	10850H	6 (12)	2.7	4.9	5.1		350–1150	12 MB		April 2020
	10750H		2.6	4.8	5.0
Core i5	10500H		2.5	4.5	—		350–1050			December 2020
	10400H	4 (8)	2.6	4.6			350–1100	8 MB		April 2020
	10300H		2.5	4.5			350–1050
	10200H		2.4	4.1						August 2020

Ice Lake-U

Common features:

• Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1068NG7	4 (8)	2.3	4.1	Iris Plus (G7)	300–1100	8 MB	28 W	May 2020
	1068G7								August 2019
	1065G7		1.3	3.9				15 W
Core i5	1038NG7		2.0	3.8		300–1050	6 MB	28 W	May 2020
	1035G7		1.2	3.7				15 W	August 2019
	1035G4		1.1		Iris Plus (G4)
	1035G1		1.0	2.6	UHD Graphics (G1)
Core i3	1005G1	2 (4)	1.2	3.4		300–900	4 MB

Ice Lake-Y

Common features:

• Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
• All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1060G7	4 (8)	1.0	3.8	Iris Plus (G7)	300–1100	8 MB	9 W	Q3 2019
Core i5	1030NG7		1.1	3.5		300–1050	6 MB	10 W	Q2 2020
	1030G7		0.8					9 W	Q3 2019
	1030G4		0.7		Iris Plus (G4)
Core i3	1000NG4	2 (4)	1.1	3.2		300–900	4 MB		Q2 2020
	1000G4								Q3 2019
	1000G1				UHD Graphics (G1)

Amber Lake-Y (10xxx)

Common features:

• Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10510Y	4 (8)	1.2	4.5	UHD 620	300–1150	8 MB	7 W	August 2019
Core i5	10310Y		1.1	4.1		300–1050	6 MB
	10210Y		1.0	4.0
Core i3	10110Y	2 (4)				300–1000	4 MB
	10100Y		1.3	3.9	UHD 615			5 W	January 2021

Core i (11th gen)

Tiger Lake-UP3

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1195G7	4 (8)	1.3–2.9	5.0	Iris Xe (96 EU)	?–1400	12 MB	12–28 W	June 2021
	1185G7		1.2–3.0	4.8		?–1350			September 2020
	1165G7		1.2–2.8	4.7		?–1300
Core i5	1155G7		1.0–2.5	4.5	Iris Xe (80 EU)	?–1350	8 MB		June 2021
	1145G7		1.1–2.6	4.4		?–1300			January 2021
	1135G7		0.9–2.4	4.2					September 2020
Core i3	1125G4		0.9–2.0	3.7	UHD Graphics (48 EU)	?–1250			Q1 2021
	1115G4	2 (4)	1.7–3.0	4.1			6 MB		September 2020

Tiger Lake-UP4

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel LPDDR4X-4266 RAM.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1180G7	4 (8)	0.9–2.2	4.6	Iris Xe (96 EU)	?–1100	12 MB	7–15 W	January 2021
	1160G7		0.9–2.1	4.4					September 2020
Core i5	1140G7		0.8–1.8	4.2	Iris Xe (80 EU)		8 MB		January 2021
	1130G7			4.0					September 2020
Core i3	1120G4		0.8–1.5	3.5	UHD Graphics (48 EU)				Q1 2021
	1110G4	2 (4)	1.8	3.9			6 MB		September 2020

Tiger Lake-H

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	11980HK	8 (16)	2.6–3.3	5.0	UHD Graphics (32 EU)	350–1450	24 MB	45–65 W	May 2021
	11950H		2.1–2.6					35–45 W
	11900H		2.1–2.5	4.9
Core i7	11850H			4.8
	11800H		1.9–2.3	4.6
	11600H	6 (12)	2.5–2.9				18 MB		July 2021
Core i5	11500H		2.4–2.9				12 MB		May 2021
	11400H		2.2–2.7	4.5	UHD Graphics (16 EU)
	11260H		2.1–2.6	4.4		350–1400

Tiger Lake-H35

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
• PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	11390H	4 (8)	2.9–3.4	5.0	Iris Xe (96 EU)	?–1400	12 MB	28–35 W	June 2021
	11375H		3.0–3.3			?–1350			January 2021
	11370H			4.8
Core i5	11320H		2.5–3.2	4.5			8 MB		June 2021
	11300H		2.6–3.1	4.4	Iris Xe (80 EU)	?–1300			January 2021

Core i (12th gen)

Alder Lake-U

Common features:

• Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
• All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
• ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1265U	2 (4)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1250	12 MB	15 W	55 W	February 2022
	1260U		1.1	4.7		0.8	3.5		?–950		9 W	29 W
	1255U		1.7			1.2			?–1250		15 W	55 W
	1250U		1.1			0.8			?–950		9 W	29 W
Core i5	1245U		1.6	4.4		1.2	3.3	Iris Xe (80 EU)	?–1200		15 W	55 W
	1240U		1.1			0.8			?–900		9 W	29 W
	1235U		1.3			0.9			?–1200		15 W	55 W
	1230U		1.0			0.7			?–850		9 W	29 W
Core i3	1215U		1.2		4 (4)	0.9		UHD Graphics (64 EU)	?–1100	10 MB	15 W	55 W
	1210U		1.0			0.7			?–850		9 W	29 W

Alder Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The following models are available with IPU (infrastructure processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1280P	6 (12)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1450	24 MB	28 W	64 W	February 2022
	1270P	4 (8)	2.2			1.6	3.5		?–1400	18 MB
	1260P		2.1	4.7		1.5	3.4
Core i5	1250P		1.7	4.4		1.2	3.3	Iris Xe (80 EU)		12 MB
	1240P								?–1300
Core i3	1220P	2 (4)	1.5			1.1		UHD Graphics (64 EU)	?–1100

Alder Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12900HK	6 (12)	2.5	5.0	8 (8)	1.8	3.8	Iris Xe (96 EU)	?–1450	24 MB	45 W	115 W	January 2022
	12900H
Core i7	12800H		2.4	4.8			3.7		?–1400
	12700H		2.3	4.7		1.7	3.5
	12650H				4 (4)			UHD Graphics (64 EU)
Core i5	12600H	4 (8)	2.7	4.5	8 (8)	2.0	3.3	Iris Xe (80 EU)		18 MB		95 W
	12500H		2.5			1.8			?–1300
	12450H		2.0	4.4	4 (4)	1.5		UHD Graphics (48 EU)	?–1200	12 MB

Alder Lake-HX

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i9 models have unlocked multipliers, allowing them to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12950HX	8 (16)	2.3	5.0	8 (8)	1.7	3.6	UHD Graphics (32 EU)	?–1550	30 MB	55 W	157 W	May 2022
	12900HX
Core i7	12850HX		2.1	4.8		1.5	3.4		?–1450	25 MB
	12800HX		2.0
	12650HX	6 (12)		4.7			3.3			24 MB
Core i5	12600HX	4 (8)	2.5	4.6		1.8			?–1350	18 MB
	12450HX		2.4	4.4	4 (4)		3.1	UHD Graphics (16 EU)	?–1300	12 MB

Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

• Socket: BGA 1264.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
• All CPU models provide 9 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache: 2 MB per cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP		Release date
			Base	Turbo	Model	Clock (MHz)		Base	Max. Turbo
Core i3	N305	8 (8)	1.8	3.8	UHD Graphics (32 EU)	?–1250	6 MB	15 W	35 W	January 2023
	N300		0.8					7 W	25 W

Core i (13th gen)

Raptor Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i3-1315U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1365U	2 (4)	1.8	5.2	8 (8)	1.3	3.9	Iris Xe (96 EU)	?–1300	12 MB	15 W	55 W	January 2023
	1355U		1.7	5.0		1.2	3.7
Core i5	1345U		1.6	4.7			3.5	Iris Xe (80 EU)	?–1250
	1335U		1.3	4.6		0.9	3.4
	1334U
Core i3	1315U		1.2	4.5	4 (4)		3.3	UHD Graphics (64 EU)		10 MB
	1305U	1 (2)	1.6			1.2

Raptor Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1370P	6 (12)	1.9	5.2	8 (8)	1.4	3.9	Iris Xe (96 EU)	?–1500	24 MB	28 W	64 W	January 2023
	1360P	4 (8)	2.2	5.0		1.6	3.7			18 MB
Core i5	1350P		1.9	4.7		1.4	3.5	Iris Xe (80 EU)		12 MB
	1340P			4.6			3.4		?–1450

Raptor Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
• The i5-13500H is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13900HK	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W	January 2023
	13900H
Core i7	13800H		2.5	5.2		1.8	4.0
	13700H		2.4	5.0			3.7
	13620H			4.9	4 (4)		3.6	UHD Graphics (64 EU)
Core i5	13600H	4 (8)	2.8	4.8	8 (8)	2.1		Iris Xe (80 EU)		18 MB		95 W
	13500H		2.6	4.7		1.9	3.5		?–1450
	13420H		2.1	4.6	4 (4)	1.5	3.4	UHD Graphics (48 EU)	?–1400	12 MB

Raptor Lake-PX

Common features:

• Socket: BGA 1792.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13905H	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W	January 2023
Core i7	13705H		2.4	5.0		1.8	3.7
Core i5	13505H	4 (8)	2.6	4.7		1.9	3.5	Iris Xe (80 EU)	?–1450	18 MB

Raptor Lake-HX

For the 14th generation refresh, see section § Raptor Lake-HX Refresh below.

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.
• i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13980HX	8 (16)	2.2	5.6	16 (16)	1.6	4.0	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W	January 2023
	13950HX			5.5
	13900HX			5.4			3.9
Core i7	13850HX		2.1	5.1	12 (12)	1.5	3.8		?–1600	30 MB
	13700HX			5.0	8 (8)		3.6		?–1550
	13650HX	6 (12)	2.6	4.9		1.9		UHD Graphics (16 EU)		24 MB
Core i5	13600HX			4.7				UHD Graphics (32 EU)	?–1500
	13500HX		2.5	4.6		1.8	3.5
	13450HX		2.4		4 (4)		3.4	UHD Graphics (16 EU)	?–1450	20 MB

Core i (14th gen)

Raptor Lake-HX Refresh

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.
• i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	14900HX	8 (16)	2.2	5.8	16 (16)	1.6	4.1	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W	January 2024
Core i7	14700HX		2.1	5.5	12 (12)	1.5	3.9		?–1600	33 MB
	14650HX		2.2	5.2	8 (8)	1.6	3.7	UHD Graphics (16 EU)		30 MB
Core i5	14500HX	6 (12)	2.6	4.9		1.9	3.5	UHD Graphics (32 EU)	?–1550	24 MB
	14450HX		2.4	4.8	4 (4)	1.8		UHD Graphics (16 EU)	?–1500	20 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Raptor Lake-U Refresh

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Xe-LP architecture.
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The Core 3 100U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 7	150U	2 (4)	1.8	5.4	8 (8)	1.2	4.0	Intel Graphics (96 EU)	?–1300	12 MB	15 W	55 W	January 2024
Core 5	120U		1.4	5.0		0.9	3.8	Intel Graphics (80 EU)	?–1250
Core 3	100U		1.2	4.7	4 (4)		3.3	Intel Graphics (64 EU)		10 MB

Meteor Lake-U

Common features:

• Socket: BGA 2049.
• All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	165U	2 (4)	1.7	4.9	8 (8)	1.2	3.8	Intel Graphics (4 Xe-cores)	?–2000	12 MB	15 W	57 W	December 2023
	164U		1.1	4.8		0.7			?–1800		9 W	30 W
	155U		1.7			1.2			?–1950		15 W	57 W
Core Ultra 5	135U		1.6	4.4		1.1	3.6		?–1900
	134U		0.7			0.5			?–1750		9 W	30 W
	125U		1.3	4.3		0.8			?–1850		15 W	57 W
	115U		1.5	4.2	4 (4)	1.0	3.5	Intel Graphics (3 Xe-cores)	?–1800	10 MB

Meteor Lake-H

Common features:

• Socket: BGA 2049.
• All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	185H	6 (12)	2.3	5.1	8 (8)	1.8	3.8	Intel Arc (8 Xe-cores)	?–2350	24 MB	45 W	115 W	December 2023
Core Ultra 7	165H		1.4	5.0		0.9			?–2300		28 W
	155H			4.8					?–2250
Core Ultra 5	135H	4 (8)	1.7	4.6		1.2	3.6		?–2200	18 MB
	125H		1.2	4.5		0.7		Intel Arc (7 Xe-cores)

Embedded processors

Core i (1st gen)

Arrandale

Common features:

• Socket: BGA 1288.
• All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	660UE	2 (4)	1.33	2.40	HD Graphics	166–500	4 MB	18 W	August 2010
	620LE		2.00	2.80		266–566		25 W	January 2010
	620UE		1.06	2.13		166–500		18 W
	610E		2.53	3.20		500–766		35 W
Core i5	520E		2.40	2.93			3 MB
Core i3	330E		2.13	—		500–666

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:

• Core i7-2600
• Core i5-2400
• Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features:

• Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
• All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	2715QE	4 (8)	2.1	3.0	HD 3000	650–1200	6 MB	45 W	January 2011
	2710QE
	2655LE	2 (4)	2.2	2.9		650–1000	4 MB	25 W	February 2011
	2610UE		1.5	2.4		350–850		17 W
Core i5	2515E		2.5	3.1		650–1100	3 MB	35 W
	2510E
Core i3	2340UE		1.3	—		350–800		17 W	June 2011
	2330E		2.2			650–1050		35 W
	2310E		2.1						February 2011

Gladden

Common features:

• Socket: BGA 1284.
• All the CPUs support dual-channel DDR3-1333 RAM.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date
			Base	Turbo
Core i3	2115C	2 (4)	2.0	—	3 MB	25 W	Q2 2012

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:

• Core i7-3770
• Core i5-3550S
• Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features:

• Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
• All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
• i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	3615QE	4 (8)	2.3	3.3	HD 4000	650–1000	6 MB	45 W	April 2012
	3610QE
	3612QE		2.1	3.1				35 W
	3555LE	2 (4)	2.5	3.2		550–1000	4 MB	25 W	June 2012
	3517UE		1.7	2.8		350–1000		17 W
Core i5	3610ME		2.7	3.3		650–950	3 MB	35 W
Core i3	3217UE		1.6	—		350–900		17 W	August 2012
	3120ME		2.4			650–900		35 W

Gladden

Common features:

• Socket: BGA 1284.
• All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
• All CPU models provide 20 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date
			Base	Turbo
Core i3	3115C	2 (4)	2.5	—	4 MB	25 W	Q3 2013

Core i (4th gen)

Haswell-DT

Common features:

• Socket: LGA 1150.
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4770TE	4 (8)	2.3	3.3	HD 4600	350–1000	8 MB	45 W	June 2013
Core i5	4570TE	2 (4)	2.7				4 MB	35 W
Core i3	4340TE		2.6	—					May 2014
	4330TE		2.4						September 2013

The following models from the Haswell-DT desktop range are also available as embedded processors:

• Core i7-4790S
• Core i7-4770S
• Core i5-4590S
• Core i5-4590T
• Core i5-4570S
• Core i3-4360
• Core i3-4350T
• Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4860EQ	4 (8)	1.8	3.2	Iris Pro 5200	750–1000	6 MB	47 W	August 2013
	4850EQ		1.6	3.2		650–1000
	4701EQ		2.4	3.4	HD 4600	400–1000			Q3 2013
	4700EQ								June 2013
	4700EC		2.7	—	—		8 MB	43 W	March 2014
	4702EC		2.0					27 W
Core i5	4422E	2 (4)	1.8	2.9	HD 4600	400–900	3 MB	25 W	April 2014
	4410E		2.9	—		400–1000		37 W
	4400E		2.7	3.3		400–1000			September 2013
	4402E		1.6	2.7		400–900		25 W
	4402EC		2.5	—	—		4 MB	27 W	March 2014
Core i3	4110E		2.6		HD 4600	400–900	3 MB	37 W	April 2014
	4112E		1.8					25 W
	4100E		2.4					37 W	September 2013
	4102E		1.6					25 W

Core i (5th gen)

Broadwell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5850EQ	4 (8)	2.7	3.4	Iris Pro 6200	300–1000	6 MB	47 W	June 2015
	5700EQ		2.6		HD 5600

Core i (6th gen)

Skylake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6700TE	4 (8)	2.4	3.4	HD 530	350–1000	8 MB	35 W	September 2015
Core i5	6500TE	4 (4)	2.3	3.3			6 MB
Core i3	6100TE	2 (4)	2.7	—			4 MB		Q4 2015

Skylake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6820EQ	4 (8)	2.8	3.5	HD 530	350–1000	8 MB	45 W	October 2015
	6822EQ		2.0	2.8				25 W
Core i5	6440EQ	4 (4)	2.7	3.4			6 MB	45 W
	6442EQ		1.9	2.7				25 W
Core i3	6100E	2 (4)	2.7	—		350–950	3 MB	35 W
	6102E		1.9					25 W

Core i (7th gen)

Kaby Lake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i3	7101E	2 (4)	3.9	—	HD 610	350–1100	3 MB	54 W	January 2017
	7101TE		3.4					35 W

Kaby Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2400 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7820EQ	4 (8)	3.0	3.7	HD 630	350–1000	8 MB	45 W	January 2017
Core i5	7440EQ	4 (4)	2.9	3.6			6 MB
	7442EQ		2.1	2.9				25 W
Core i3	7100E	2 (4)	2.9	—		350–950	3 MB	35 W
	7102E		2.1					25 W

Core i (8th gen)

Whiskey Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8665UE	4 (8)	1.7	4.4	UHD 620	300–1150	8 MB	15 W	April 2019
Core i5	8365UE		1.6	4.1		300–1050	6 MB		June 2019
Core i3	8145UE	2 (4)	2.2	3.9		300–1000	4 MB

Core i (9th gen)

Coffee Lake-R

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	9700E	8 (8)	2.6	4.4	UHD 630	350–1150	12 MB	65 W	June 2019
	9700TE		1.8	3.8				35 W
Core i5	9500E	6 (6)	3.0	4.2		350–1100	9 MB	65 W
	9500TE		2.2	3.6				35 W
Core i3	9100E	4 (4)	3.1	3.7		350–1050	6 MB	65 W
	9100TE		2.2	3.2				35 W

Coffee Lake-H (refresh)

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	9850HE	6 (12)	2.7	4.4	UHD 630	350–1150	9 MB	45 W	June 2019
	9850HL		1.9	4.1				25 W
Core i3	9100HL	4 (4)	1.6	2.9		350–1100	6 MB

Core i (10th gen)

Comet Lake-S

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• i9-10900E features Thermal Velocity Boost.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	10900E	10 (20)	2.8	4.7	UHD 630	350–1200	20 MB	65 W	April 2020
	10900TE		1.8	4.5				35 W
Core i7	10700E	8 (16)	2.9			350–1150	16 MB	65 W	May 2020
	10700TE		2.0	4.4				35 W
Core i5	10500E	6 (12)	3.1	4.2			12 MB	65 W	April 2020
	10500TE		2.3	3.7				35 W
Core i3	10100E	4 (8)	3.2	3.8		350–1100	6 MB	65 W
	10100TE		2.3	3.6				35 W

Core i (11th gen)

Tiger Lake-UP3

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
• -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1185GRE	4 (8)	1.8	4.4	Iris Xe (96 EU)	?–1350	12 MB	15 W	September 2020
	1185G7E
Core i5	1145GRE		1.5	4.1	Iris Xe (80 EU)	?–1300	8 MB
	1145G7E
Core i3	1115GRE	2 (4)	2.2	3.9	UHD Graphics (48 EU)	?–1250	6 MB
	1115G4E

Tiger Lake-H

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
• Minimum operating temperature: 0°C.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	11850HE	8 (16)	2.1–2.6	4.7	UHD Graphics (32 EU)	350–1350	24 MB	35–45 W	August 2021
Core i5	11500HE	6 (12)		4.5			12 MB
Core i3	11100HE	4 (8)	1.9–2.4	4.4	UHD Graphics (16 EU)	350–1250	8 MB

Core i (12th gen)

Alder Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• Turbo Boost version is 2.0.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP	Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)
			Base	Turbo		Base	Turbo
Core i9	12900E	8 (16)	2.3	5.0	8 (8)	1.7	3.8	UHD 770	300–1550	30 MB	65 W	January 2022
	12900TE		1.1	4.8		1.0	3.6				35 W
Core i7	12700E		2.1		4 (4)	1.6			300–1500	25 MB	65 W
	12700TE		1.4	4.6		1.0	3.4				35 W
Core i5	12500E	6 (12)	2.9	4.5	—				300–1450	18 MB	65 W
	12500TE		1.9	4.3							35 W
Core i3	12100E	4 (8)	3.2	4.2				UHD 730	300–1400	12 MB	60 W
	12100TE		2.1	4.0							35 W

Alder Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1265UE	2 (4)	?	4.7	8 (8)	?	3.5	Iris Xe (96 EU)	?–1250	12 MB	15 W	55 W	February 2022
Core i5	1245UE		?	4.4		?	3.3	Iris Xe (80 EU)	?–1200
Core i3	1215UE		?		4 (4)	?		UHD Graphics (64 EU)	?–1100	10 MB

Alder Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1270PE	4 (8)	?	4.5	8 (8)	?	3.3	Iris Xe (96 EU)	?–1350	18 MB	28 W	64 W	February 2022
Core i5	1250PE		?	4.4		?	3.2	Iris Xe (80 EU)	?–1300	12 MB
Core i3	1220PE		?	4.2	4 (4)	?	3.1	UHD Graphics (48 EU)	?–1250				Q1 2022

Alder Lake-PS

Common features:

• Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	12800HL	6 (12)	2.4	4.8	8 (8)	1.8	3.7	Iris Xe (96 EU)	?–1400	24 MB	45 W	65 W	Q3 2022
	12700HL		2.3	4.7		1.7	3.5
	1265UL	2 (4)	1.8	4.8		1.3	2.7		?–1250	12 MB	15 W	28 W
	1255UL		1.7	4.7		1.2	2.6
Core i5	12600HL	4 (8)	2.7	4.5		2.0	3.3	Iris Xe (80 EU)	?–1400	18 MB	45 W	65 W
	12500HL		2.5			1.8
	1245UL	2 (4)	1.6	4.4		1.2	2.5		?–1250	12 MB	15 W	28 W
	1235UL		1.3			1.1			?–1200
Core i3	12300HL	4 (8)	2.0		4 (4)	1.5	3.3	UHD Graphics (48 EU)	?–1400		45 W	65 W
	1215UL	2 (4)	1.2			0.9	2.5	UHD Graphics (64 EU)	?–1100	10 MB	15 W	28 W

Alder Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	12800HE	6 (12)	2.4	4.6	8 (8)	1.8	3.5	Iris Xe (96 EU)	?–1350	24 MB	45 W	115 W	January 2022
Core i5	12600HE	4 (8)	2.5	4.5			3.3	Iris Xe (80 EU)	?–1300	18 MB
Core i3	12300HE		1.9	4.3	4 (4)	1.5		UHD Graphics (48 EU)	?–1150	12 MB

Core i (13th gen)

Raptor Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
  • E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• Turbo Boost version is 2.0.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP	Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)
			Base	Turbo		Base	Turbo
Core i9	13900E	8 (16)	1.8	5.2	16 (16)	1.3	4.0	UHD 770	300–1650	36 MB	65 W	January 2023
	13900TE		1.0	5.0		0.8	3.9				35 W
Core i7	13700E		1.9	5.1	8 (8)	1.3			300–1600	30 MB	65 W
	13700TE		1.1	4.8		0.8	3.6				35 W
Core i5	13500E	6 (12)	2.4	4.6		1.5	3.3		300–1550	24 MB	65 W
	13500TE		1.3	4.5		1.1	3.1				35 W
	13400E		2.4	4.6	4 (4)	1.5	3.3			20 MB	65 W
Core i3	13100E	4 (8)	3.3	4.4	—			UHD 730	300–1500	12 MB	60 W
	13100TE		2.4	4.1							35 W

Raptor Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1365UE	2 (4)	1.7	4.9	8 (8)	1.3	3.7	Iris Xe (96 EU)	?–1300	12 MB	15 W	55 W	January 2023
Core i5	1345UE		1.4	4.6		1.2	3.4	Iris Xe (80 EU)	?–1250
	1335UE		1.3	4.5		0.9	3.3
Core i3	1315UE		1.2		4 (4)			UHD Graphics (64 EU)	?–1200	10 MB

Raptor Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1370PE	6 (12)	1.9	4.8	8 (8)	?	3.7	Iris Xe (96 EU)	?–1400	24 MB	28 W	64 W	January 2023
Core i5	1350PE	4 (8)	1.8	4.6		?	3.4	Iris Xe (80 EU)		12 MB
	1340PE			4.5		?	3.3		?–1350
Core i3	1320PE		1.7		4 (4)	?		UHD Graphics (48 EU)	?–1200

Raptor Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	13800HE	6 (12)	2.5	5.0	8 (8)	1.8	4.0	Iris Xe (96 EU)	?–1400	24 MB	45 W	115 W	January 2023
Core i5	13600HE	4 (8)	2.7	4.8		2.1	3.6	Iris Xe (80 EU)		18 MB
Core i3	13300HE		2.1	4.6	4 (4)	1.9	3.4	UHD Graphics (48 EU)	?–1300	12 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Meteor Lake-PS

Common features:

• Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
• All the CPUs support dual-channel DDR5-5600 RAM.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	165HL	6 (12)	1.4	5.0	8 (8)	0.9	3.8	Intel Arc (8 Xe-cores)	?–2300	24 MB	45 W	115 W	April 2024
	155HL			4.8					?–2250
	165UL	2 (4)	1.7	4.9		1.2		Intel Graphics (4 Xe-cores)	?–2000	12 MB	15 W	57 W
	155UL			4.8					?–1950
Core Ultra 5	135HL	4 (8)		4.6		1.2	3.6	Intel Arc (8 Xe-cores)	?–2200	18 MB	45 W	115 W
	125HL		1.2	4.5		0.7		Intel Arc (7 Xe-cores)
	135UL	2 (4)	1.6	4.4		1.1		Intel Graphics (4 Xe-cores)	?–1900	12 MB	15 W	57 W
	125UL		1.3	4.3		0.8			?–1850
Core Ultra 3	105UL		1.5	4.2	4 (4)	1.0	3.5	Intel Graphics (3 Xe-cores)	?–1800	10 MB

See also

• List of Intel Pentium M microprocessors
• List of Intel Celeron microprocessors
• List of Intel Pentium processors
• Intel Core
• Intel Core 2
• Comparison of Intel processors
• Enhanced Pentium M (microarchitecture)
• Intel Core (microarchitecture)
• Penryn (microarchitecture)
• Alder Lake (microprocessor)

References

• ATI provides pointer to Intel's 'Allendale', May 23, 2006
• Rumoured prices and specifications for Intel Core 2, May 30, 2006
• TGDaily indicates leaked release dates, July 24, 2006
• Intel to unveil five Merom CPUs in July, paper says(subscription required) as re-reported by DigiTimes, July 17, 2006
• Intel Unveils World's Best Processor, July 27, 2006
• Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip, July 16, 2007
• CORE 2 DUO 1333 MHZ STEPPING Archived May 20, 2022, at the Wayback Machine, July 18, 2007

External links

• Search MDDS Database
• Intel ARK Database
• SSPEC/QDF Reference (Intel)
• Intel® Processor Names, Numbers and Generation List
• Intel CPU Transition Roadmap 2008–2013
• Intel Desktop CPU Roadmap 2004–2011
• Intel Core Solo mobile processor product order code table
• Intel Core Duo mobile processor product order code table
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
• Intel Core 2 Duo Processors Technical Documents
• Intel Core i3 desktop processor product order code table
• Intel Core i3 mobile processor product order code table
• Intel Core i5 desktop processor product order code table
• Intel Core i5 mobile processor product order code table
• Intel Core i7 desktop processor product order code table
• Intel Core i7 mobile processor product order code table
• Intel Core i7 desktop processor Extreme Edition product order code table
• Intel Core i7 mobile processor Extreme Edition product order code table
• Intel's Core i7 web page
• Intel's Core i7 Extreme Edition web page
• Intel's Core i7 Processor Numbers
• Intel's Core i7 Extreme Edition Processor Numbers
• Intel Corporation – Processor Price List
• Intel Corporation – Processor Price List
• Intel Core X-series processors