Thin small outline package

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.^[1]

History[edit]

The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.^[2]

Physical properties[edit]

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. ^[3]

Type I[edit]

Part number	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
TSOP28	28	8.1	11.8	0.55
TSOP28/32	28/32	8	18.4	0.5
TSOP40	40	10	18.4	0.5
TSOP48	48	1	18.4	0.5
TSOP56	56	14	18.4	0.5

Type II[edit]

Part number	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
TSOP6 (SOT457)^[4]	6	1.5	2.9	0.95
TSOP20/24/26	20/24/26	7.6	17.14	1.27
TSOP24/28	24/28	10.16	18.41	1.27
TSOP32	32	10.16	20.95	1.27
TSOP40/44	40/44	10.16	18.42	0.8
TSOP50	50	10.16	20.95	0.8
TSOP54	54	10.16	22.22	0.8
TSOP66	66	10.16	22.22	0.65

HTSOP[edit]

HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side.^{[citation needed]} The pad is soldered to the PCB to transfer heat from the package to the PCB.

Similar packages[edit]

There are a variety of small form-factor IC carrier available other than TSOPs

Small-outline integrated circuit (SOIC)
Plastic small-outline package (PSOP)
Shrink small-outline package (SSOP)
Thin-shrink small outline package (TSSOP)

References[edit]

^ Intel (1999). "Small Outline Package Guide" (PDF). p. 1-1. Archived from the original (PDF) on February 11, 2017. Retrieved December 17, 2021.
^ Texas Instruments. "Recent Advancements in Bus-Interface Packaging and Processing". 1997. p. 2
^ SiliconFarEast: "TSOP - Thin Small Outline Package"
^ "Sc-74; Tsop6 (Sot457)".

External links[edit]

TSOP Package Information from Amkor Technology

[1] Intel (1999). "Small Outline Package Guide" (PDF). p. 1-1. Archived from the original (PDF) on February 11, 2017. Retrieved December 17, 2021.

[2] Texas Instruments. "Recent Advancements in Bus-Interface Packaging and Processing". 1997. p. 2

[3] SiliconFarEast: "TSOP - Thin Small Outline Package"

[4] "Sc-74; Tsop6 (Sot457)".

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v t e Semiconductor packages
Single diode	DO-201 (DO-27) DO-204 (DO-7 / DO-26 / DO-35 / DO-41) DO-213 (MELF / SOD-80 / LL34) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin	SOT / TSOT TO-3 (TH / Panel) TO-5 (TH) TO-8 (TH) TO-18 (TH) TO-39 (TH) TO-66 (TH / Panel) TO-92 (TH) TO-126 (TH / Panel) TO-202 (TH / Panel) TO-220 (TH / Panel) TO-247 (TH / Panel) TO-251 (IPAK) (SMT) TO-252 (DPAK) (SMT) TO-262 (I2PAK) (SMT) TO-263 (D2PAK) (SMT) TO-268 (D3PAK) (SMT) TO-273 (Super-220) (SMT) TO-274 (Super-247) (SMT)
Single row	SIP / SIL
Dual row	DFN DIP / DIL Flat Pack MSOP SO / SOIC SOP / SSOP TSOP / HTSOP TSSOP / HTSSOP ZIP
Quad row	LCC QIP / QIL PLCC QFN QFP QUIP / QUIL
Grid array	BGA eWLB LGA PGA
Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP
Related topics	Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.