List of Qualcomm Snapdragon systems on chips

Qualcomm Snapdragon

General information
Launched	2007 (2007)
Designed by	Qualcomm
Architecture and classification
Application	Mobile SoC and 2-in-1 PC
Microarchitecture	ARM9, ARM11, ARM Cortex-A, Cortex-X1, Cortex-X2, Cortex-X3, Cortex-X4, Scorpion, Krait, Kryo
Instruction set	ARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Physical specifications
Cores	1, 2, 4, 6, or 8

This is a list of Qualcomm Snapdragon systems on chips (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.

Model number	Fab	CPU	GPU (or Gfx Core)	Connectivity	Sampling availability
QSC1xxx
QSC1100					Q4 2007
QSC6xxx
QSC6010		ARMv5TEJ ARM926EJ-S	No 3D and ARM 2D	None	2006
QSC6020
QSC6030
QSC6240				HSDPA	Q3 2007
QSC6245-1				HSDPA	Q3 2007
QSC6055					Q1 2007
QSC6065				HSDPA	Q2 2007
QSC6260-1					Q3 2007
QSC6270				HSDPA
QSC6075					Q2 2007
QSC6085				DOrA	Q4 2007
MSM6xxx
MSM6000				None	2006
MSM6025
MSM6050
MSM6100			ARM-DSP 3D and ARM 2D
MSM6125
MSM6150			Defender2 3D and ARM 2D
MSM6175
MSM6225			No 3D and ARM 2D	HSDPA
MSM6250			ARM-DSP 3D and ARM 2D	WCDMA	2006
MSM6250A			No 3D and ARM 2D	WCDMA
MSM6245				WEDGE
MSM6255A
MSM6260		ARMv5TEJ ARM926EJ-S @ 225 MHz	ARM-DSP 3D and ARM 2D	HSUPA
MSM6275			Defender2 3D and ARM 2D
MSM6280
MSM6280A			Stargate 3D and ARM 2D		2007
MSM6800A			Defender3 3D and ARM 2D	DOrA	2006
MSM6575				DOr0
MSM6550		ARMv5TEJ ARM926EJ-S @ 225 MHz	Defender2 3D and ARM 2D
MSM6550A
MSM6800				DOrA
MSM6500		ARMv5TEJ ARM926EJ-S @ 150 MHz	ARM-DSP 3D and ARM 2D	DOr0
MSM7xxx
MSM7200			Imageon 3D Imageon 2D	HSUPA	2006
MSM7200A		ARM11 @ 528 MHz			Q1 2007
MSM7201					2008
MSM7500				DOrA	2006
MSM7500A					Q4 2007
MSM7600	65 nm	ARM1136J-S @ 528 MHz		HSUPA and DOrA	Q1 2007
MSM7850			LT 3D and LT 2D	DOrB	2008

Snapdragon S series

Snapdragon S1 notable features over its predecessor (MSM7xxx):

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S1

• CPU features
  • 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11
  • Up to 256K L2 cache
  • Up to 32K+32K L1 cache
• GPU features
  • Adreno 200 (From Software rendered or Adreno 130)
    • OpenGL ES 1.1
    • OpenVG 1.0
    • Direct3D Mobile
    • Unified shader model 5-way VLIW
• DSP features
  • Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz
• ISP features
  • Up to 12 MP camera
• Modem and wireless features
  • External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models
• 45 or 65 nm manufacturing technology

Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7225	65 nm	1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache	Software rendered 2D support (HVGA)	Hexagon QDSP5 320 MHz	Up to 5 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0	2007
MSM7625							CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227		1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache	Adreno 200 226 MHz (FWVGA)		Up to 8 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0	2008
MSM7627							CDMA/UMTS; GSM
MSM7225A	45 nm	1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (HVGA)	Hexagon QDSP5 350 MHz	Up to 5 MP camera	LPDDR Single-channel 200 MHz (1.6 GB/s)	UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0	Q4 2011
MSM7625A							CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A		1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (FWVGA)		Up to 8 MP camera		UMTS, MBMS; GSM
MSM7627A							CDMA2000/UMTS, MBMS; GSM
MSM7225AB							UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250	65 nm	1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 226 MHz (WXGA)	Hexagon QDSP6 600 MHz	Up to 12 MP camera	LPDDR Single-channel 400 MHz	UMTS, MBMS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0	Q4 2008
QSD8650							CDMA2000/UMTS, MBMS; GSM

Snapdragon S2 notable features over its predecessor (Snapdragon S1):

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S2

• CPU feature
  • 1 core up to 1.5 GHz Scorpion
  • ARMv7 (From ARMv6 on some model)
  • Up to 384K L2
• GPU features
  • Adreno 205 (From Software rendered or Adreno 200)
    • Up to 266 MHz
    • Up to 2 times faster than Adreno 200
    • Up to x2 relative performance on OpenGL ES 2.0 from Adreno 200
    • Up to XGA
    • OpenGL ES 2.0
    • SVGT 1.2
    • OpenVG 1.1
    • Direct Draw
    • GDI
    • Concurrent CPU, DSP, graphics and MDP
• Memory features
  • Up to LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)
• DSP features
  • Hexagon QDSP5 at 256 MHz
• 45 nm manufacturing technology
• 904 pins

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7230	45 nm	1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2	Adreno 205 266 MHz (XGA)	Hexagon QDSP5 256 MHz	Up to 12 MP camera	LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)	UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)	Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	Q2 2010
MSM7630							CDMA2000 (1×Adv, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055		1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2					—
MSM8255		1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655							CDMA2000/UMTS, MBMS; GSM
MSM8255T		1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655T							CDMA2000/UMTS, MBMS; GSM

Snapdragon S3 notable features over its predecessor (Snapdragon S2):

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S3

• CPU feature
  • 2 cores up to 1.7 GHz Scorpion
  • 512 KB L2
• GPU features
  • Adreno 220
    • Up to 4 time faster than Adreno 200
    • Up to x5 relative performance on OpenGL ES 2.0 from Adreno 200
    • EGL 1.3 (From 1.2)
    • 2x Larger L2 cache (512 KB from 256 KB)
    • Up to WXGA+
• DSP features
  • Hexagon QDSP6 at 400 MHz (From Hexagon QDSP5 at 256 MHz)
• ISP features
  • Up to 16 MP camera (From 12 MP)
• 45 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8060	45 nm	2 cores up to 1.7 GHz Scorpion: 512 KB L2	Adreno 220 266 MHz (WXGA+)	Hexagon QDSP6 400 MHz	Up to 16 MP camera	LPDDR2 Single-channel 333 MHz (2.67 GB/s)	—	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	2011
MSM8260							UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)		Q3 2010
MSM8660							CDMA2000 (1×Adv, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012.

The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)

Snapdragon S4 Play

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Play

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225	45 nm	2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2	Adreno 203 320 MHz (FWVGA)	Hexagon	Up to 8 MP camera	LPDDR2 Single-channel 300 MHz	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0	1H 2012
MSM8625							CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM

Snapdragon S4 Plus

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Plus

Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):

• CPU features
  • 2 cores up to 1.7 GHz Krait 200
  • 4+4 KB L0, 16+16 KB L1, 1 MB L2
  • Out of Order Execution (From Partial Out of Order Execution on Scorpion)
• GPU features
  • Adreno 225
    • Up to 1080p screen
    • Up to 6 time faster than Adreno 200
    • Up to 32 ALU
    • Direct3D feature level 9.0 (From 9.0)
    • Up to x7.5 relative performance on OpenGL ES 2.0 from Adreno 200
  • Adreno 305
    • Up to 1080p screen (on 400 MHz)
    • Up to 720p screen (on 320 MHz)
    • Up to 24 ALU (From 32 on S3)
    • Unified shader model Scalar instruction set (From Unified shader model 5-way VLIW)
    • Up to x8 relative performance on OpenGL ES 2.0 from Adreno 200
• DSP features
  • Up to 20 MP or 13.5 MP camera
• ISP features
  • Hexagon QDSP6
• Modem and wireless features
  • Integrated Bluetooth 4.0
  • IZat Gen8A (From IZat Gen 7)
• 28 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8227	28 nm	2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 320 MHz (FWVGA / 720p)	Hexagon QDSP6		LPDDR2 Single-channel 400 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0	2H 2012
MSM8627							CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030		2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 400 MHz (qHD / 1080p)		Up to 13.5 MP camera	LPDDR2 Single-channel 533 MHz	—		3Q 2012
MSM8230							UMTS; GSM
MSM8630							CDMA/UMTS; GSM
MSM8930							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A		2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 225 400 MHz (WUXGA / 1080p)		Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	—		2H 2012
MSM8260A							UMTS; GSM		Q1 2012
MSM8660A							CDMA/UMTS; GSM
MSM8960							World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Pro

Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):

• CPU features
  • up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
  • up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
  • 4+4 KB L0, 16+16 KB L1, 1 MB L2
• GPU features
  • Adreno 320
    • Support OpenGL ES 3.0
    • Up to 1080p screen
    • Up to 64 ALU (From 32 on S4 plus)
    • Up to x23 relative performance on OpenGL ES 2.0 from Adreno 200
• DSP features
  • Hexagon QDSP6
• ISP features
  • Up to 20 MP camera
• Modem and wireless features
  • LTE FDD/TDD Cat 3 or external on some models
• 28 nm LP manufacturing technology
• Up to eMMC 4.4/4.4.1

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8260A Pro	28 nm (TSMC 28LP)	2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 320 400 MHz (WUXGA / 1080p)	Hexagon QDSP6	Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM)		Q2 2012
MSM8960T Pro (MSM8960AB)
MSM8960DT		2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor							Q3 2013
APQ8064		4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (QXGA / 1080p)			LPDDR2 Dual-channel 533 MHz	External		2012

Snapdragon 2 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013–2019)

The Snapdragon 200 was announced in 2013.
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.
The Snapdragon 212 was announced on July 28, 2015.
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.
The Qualcomm 215 was announced on July 9, 2019. It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8225Q	Snapdragon 200	45 nm (TSMC 45LP)	4 cores up to 1.4 GHz Cortex-A5	Adreno 203 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP5	Up to 8 MP single camera	LPDDR2 Single-channel 333 MHz	Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)	Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0	—	2013
MSM8625Q								Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210		28 nm (TSMC 28LP)	2 cores up to 1.2 GHz Cortex-A7	Adreno 302 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP6			Gobi 3G (UMTS; GSM)
MSM8610								Gobi 3G (CDMA/UMTS; GSM)
MSM8212			4 cores up to 1.2 GHz Cortex-A7					Gobi 3G (UMTS; GSM)
MSM8612								Gobi 3G (CDMA/UMTS; GSM)
MSM8905	Qualcomm 205		2 cores up to 1.1 GHz Cortex-A7	Adreno 304 400 MHz (19.2 GFLOPS in FP32)	Hexagon 536	Up to 3 MP single camera	LPDDR2/3 Single-channel 384 MHz	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1 + BLE, 802.11n (2.4 GHz)	4.0	2017
MSM8208	Snapdragon 208					Up to 5 MP single camera	LPDDR2/3 Single-channel 400 MHz	Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM)		2.0	2014
MSM8909	Snapdragon 210		4 cores up to 1.1 GHz Cortex-A7			Up to 8 MP single camera	LPDDR2/3 Single-channel 533 MHz	X5 LTE
MSM8909AA	Snapdragon 212		4 cores up to 1.3 GHz Cortex-A7								2015
QM215	Qualcomm 215		4 cores up to 1.3 GHz Cortex-A53	Adreno 308 485 MHz (23.3 GFLOPS in FP32)	Hexagon	Up to 13 MP single camera / 8 MP dual camera	LPDDR3 Single-channel 672 MHz 3 GB	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0	1.0	Q3 2019

Snapdragon 4 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 4 series

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 series (2013–2021)

The Snapdragon 400 was announced in 2013.
The Snapdragon 410 was announced on December 9, 2013. It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.
The Snapdragon 412 was announced on July 28, 2015.
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.
The Snapdragon 427 was announced on October 18, 2016.
The Snapdragon 450 was announced on June 28, 2017. Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018. Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.
The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.
The Snapdragon 480+ was announced on October 26, 2021.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8026	Snapdragon 400	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)	Hexagon QDSP6	Up to 13.5 MP single camera	LPDDR2/3 Single-channel 533 MHz	—	Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS	1.0	2013
MSM8226								Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626								Gobi 3G (CDMA/UMTS)
MSM8926								Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028			4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8228								Gobi 3G (UMTS)
MSM8628								Gobi 3G (CDMA/UMTS)
MSM8928								Gobi 4G (LTE Cat 4)
MSM8230			2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)			LPDDR2 Single-channel 533 MHz	Gobi 3G (UMTS)
MSM8630								Gobi 3G (CDMA/UMTS)
MSM8930								Gobi 4G (LTE Cat 4)
MSM8930AA			2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2					Gobi 4G (LTE Cat 4)
APQ8030AB			2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8230AB								Gobi 3G (UMTS)
MSM8630AB								Gobi 3G (CDMA/UMTS)
MSM8930AB								Gobi 4G (LTE Cat 4)
APQ8016	Snapdragon 410	28 nm (TSMC 28LP) / 28 nm (SMIC)	4 cores up to 1.2 GHz Cortex-A53	Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32)	Hexagon QDSP6 V5		LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	—	Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou	2.0	H1 2014
MSM8916								X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2	Snapdragon 412	28 nm (TSMC 28LP)	4 cores up to 1.4 GHz Cortex-A53	Adreno 306 450 MHz (21.6 GFLOPS in FP32)			LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s)				H2 2015
MSM8929	Snapdragon 415		4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53)	Adreno 405 465 MHz (44.6 GFLOPS in FP32)	Hexagon V50	Up to 13 MP single camera	LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s)		Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS		H1 2015
MSM8917	Snapdragon 425		4 cores up to 1.4 GHz Cortex-A53	Adreno 308 598 MHz (28.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C		Q3 2016
MSM8920	Snapdragon 427							X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	Q1 2017
MSM8937	Snapdragon 430		4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53)	Adreno 505 450 MHz (43.2 GFLOPS in FP32)		Up to 21 MP single camera	LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X6 LTE			Q2 2016
MSM8940	Snapdragon 435							X9 LTE			Q4 2016
SDM429	Snapdragon 429	12 nm (TSMC 12FFC)	4 cores up to 2.0 GHz Cortex-A53	Adreno 504 320 MHz (30.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera / 8 MP dual camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0		Q3 2018
SDM439	Snapdragon 439		4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)	Adreno 505 650 MHz (62.4 GFLOPS in FP32)		Up to 21 MP single camera / 8 MP dual camera
SDM450	Snapdragon 450	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53	Adreno 505 600 MHz (57.6 GFLOPS in FP32)	Hexagon 546	Up to 24 MP single camera / 13 MP dual camera	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0		Q3 2017
SM4250-AA	Snapdragon 460	11 nm (Samsung 11LPP)	4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53)	Adreno 610 600 MHz (153.6 GFLOPS in FP32)	Hexagon 683	Spectra 340 (48 MP single camera / 16 MP dual camera)	LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C		Q1 2020
SM4350	Snapdragon 480	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55)	Adreno 619 650 MHz (332.8 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C	4+	H1 2021
SM4350-AC	Snapdragon 480+		2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55)						FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		Q4 2021

Snapdragon 4 (2022-2024)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.
The Snapdragon 4 Gen 2 was announced on June 26, 2023.
The Snapdragon 4 Gen 2 Leading Version was launched on Redmi Note 13R on May 17, 2024.
The Snapdragon 4s Gen 2 was announced on July 30, 2024.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4375	Snapdragon 4 Gen 1	6 nm (TSMC N6)	2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 619 700 MHz (358.4 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1	4+	Q3 2022
SM4450	Snapdragon 4 Gen 2	4 nm (Samsung 4LPX)	2 + 6 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)	Adreno 613 955 MHz (244.5 GFLOPS in FP32)	—	Spectra (108 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1		Q2 2023
	Snapdragon 4 Gen 2 Accelerated Edition	4 nm (TSMC N4)	2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)								Q2 2024
SM4635	Snapdragon 4s Gen 2	4 nm (Samsung)	2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 611		Spectra (84 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal (5G NR Sub-6: download up to 1 Gbit/s)			Q3 2024

Snapdragon 6 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 6 series

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013–2023)

The Snapdragon 600 was announced on January 8, 2013. Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.
The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.
The Snapdragon 616 was announced on July 31, 2015.
The Snapdragon 617 was announced on September 15, 2015.
The Snapdragon 625 was announced on February 11, 2016.
The Snapdragon 626 was announced on October 18, 2016. Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015. They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.
The Snapdragon 653 was announced on October 18, 2016.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.
The Snapdragon 636 was announced on October 17, 2017. Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 632 was announced on June 26, 2018. Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018. Pin and software compatible with Snapdragon 710.
The Snapdragon 675 was announced on October 22, 2018.
The Snapdragon 665 was announced on April 9, 2019.
The Snapdragon 662 was announced on January 20, 2020, with NavIC support.
The Snapdragon 678 was announced on December 15, 2020.
The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G connectivity.
The Snapdragon 680 and 695 were announced on October 26, 2021.
The Snapdragon 685 was announced on March 23, 2023.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro	Snapdragon 600	28 nm (TSMC 28LP)	4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (76.8 GFLOPS in FP32)	Hexagon QDSP6 V4 500 MHz	Up to 21 MP single camera; Video Capture: 1080p@30fps	DDR3L-1600 (12.8 GB/sec)	External	Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A	1.0	Q1 2013
APQ8064M			4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2				LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
APQ8064T							LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
APQ8064AB			4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 450 MHz (86.4 GFLOPS in FP32)
MSM8936	Snapdragon 610		4 cores 1.7 GHz Cortex-A53	Adreno 405 550 MHz (52.8 GFLOPS in FP32)	Hexagon V50 700 MHz		LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou	2.0	Q3 2014
MSM8939	Snapdragon 615		4 + 4 cores (1.7 GHz + 1.1 GHz Cortex-A53)
MSM8939 v2	Snapdragon 616		4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53)								Q3 2015
MSM8952	Snapdragon 617		4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53)		Hexagon 546		LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0	3.0	Q4 2015
MSM8953	Snapdragon 625	14 nm (Samsung 14LPP)	8 cores up to 2.0 GHz Cortex-A53	Adreno 506 650 MHz (62.4 GFLOPS in FP32)		Up to 24 MP single camera; Video Capture: 4K@30fps		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0		Q2 2016
MSM8953 Pro	Snapdragon 626		8 cores up to 2.2 GHz Cortex-A53								Q4 2016
SDM630	Snapdragon 630		4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)	Adreno 508 650 MHz (124.8 GFLOPS in FP32)	Hexagon 642	Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1	4.0	Q2 2017
SDM632	Snapdragon 632		4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53)	Adreno 506 725 MHz (69.6 GFLOPS in FP32)	Hexagon 546	Up to 40 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	Q3 2018
SDM636	Snapdragon 636		4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53)	Adreno 509 430 MHz (110.1 GFLOPS in FP32)	Hexagon 680	Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		4.0	Q4 2017
MSM8956	Snapdragon 650	28 nm (TSMC 28HPM)	2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)	Adreno 510 600 MHz (153.6 GFLOPS in FP32)	Hexagon V56	Up to 21 MP single camera; Video Capture: 4K@30fps	LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0	3.0	Q1 2016
MSM8976	Snapdragon 652		4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976 Pro	Snapdragon 653		4 + 4 cores (1.95 GHz Cortex-A72 + 1.40 GHz Cortex-A53)	Adreno 510 621 MHz (159 GFLOPS in FP32)				X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)			Q4 2016
SDM660	Snapdragon 660	14 nm (Samsung 14LPP)	4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53)	Adreno 512 647 MHz (165.6 GFLOPS in FP32)	Hexagon 680	Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4.0	Q2 2017
SDA660								Internal: no
SM6115	Snapdragon 662	11 nm (Samsung 11LPP)	4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53)	Adreno 610 950 MHz (243.2 GFLOPS in FP32)	Hexagon 683	Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps)	LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C	3.0	Q1 2020
SM6125	Snapdragon 665				Hexagon 686 (3.3 TOPS)	Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)		X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1		Q2 2019
SDM670	Snapdragon 670	10 nm (Samsung 10LPP)	2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 615 430 MHz (220.2 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)		Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4+	Q3 2018
SM6150	Snapdragon 675	11 nm (Samsung 11LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)	Adreno 612 845 MHz (216.3 GFLOPS in FP32)		Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)					Q1 2019
SM6150-AC	Snapdragon 678		2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)	Adreno 612 895 MHz (229.1 GFLOPS in FP32)							Q4 2020
SM6225	Snapdragon 680	6 nm (TSMC N6)	4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1114 MHz (285.2 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, NavIC, USB C	3.0	Q4 2021
SM6225-AD	Snapdragon 685		4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1260 MHz (322.6 GFLOPS in FP32)		Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)			FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 1x1, USB 3.1		Q1 2023
SM6350	Snapdragon 690	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55)	Adreno 619L 565 MHz (289.3 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB 3.1	4+	H2 2020
SM6375	Snapdragon 695	6 nm (TSMC N6)	2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55)	Adreno 619 840 MHz (430.1 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		Q4 2021

Snapdragon 6 (2022–2024)

The Snapdragon 6 Gen 1 was announced on September 6, 2022.
The Snapdragon 6s Gen 3 was announced on June 6, 2024.
The Snapdragon 6s Gen 1 was launched on Oppo A3x on August 9, 2024.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6450	Snapdragon 6 Gen 1	4 nm (Samsung 4LPX)	4 + 4 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 710 676 MHz (346.1 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q1 2023
SM6115	Snapdragon 6s Gen 1		4 + 4 cores (2.1 GHz Kryo Gold – Cortex-A73 + 2.0 GHz Kryo Silver – Cortex-A53)	Adreno 610 1050 MHz (268.8 GFLOPS in FP32)			LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)				Q3 2024
SM6375-AC	Snapdragon 6s Gen 3	6 nm (TSMC N6)	2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 2.0 GHz Kryo Silver – Cortex-A55)	Adreno 619	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)		Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C	4+	Q2 2024

Snapdragon 7 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.

Snapdragon 700 series (2018–2022)

The Snapdragon 710 was announced on May 23, 2018. It is pin and software compatible with the Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.
The Snapdragon 730 and 730G were announced on April 9, 2019.
The Snapdragon 720G was announced on January 20, 2020.
The Snapdragon 732G was announced on August 31, 2020.
The Snapdragon 765 and 765G were announced on December 4, 2019 as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the Play Store.
The Snapdragon 768G was announced on May 10, 2020.
The Snapdragon 750G was announced on September 22, 2020.
The Snapdragon 780G was announced on March 25, 2021.
The Snapdragon 778G was announced on May 19, 2021.
The Snapdragon 778G+ was announced on October 26, 2021.
The Snapdragon 782G was announced on November 23, 2022.

Model number	Product Name	Fab	CPU (ARMv8.2)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM710	Snapdragon 710	10 nm (Samsung 10LPP)	2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 504 MHz (258 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; NFC; 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4	Q2 2018
SDM712	Snapdragon 712		2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 610 MHz (312.3 GFLOPS in FP32)						4+	Q1 2019
SM7125	Snapdragon 720G	8 nm (Samsung 8LPP)	2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55)	Adreno 618 750 MHz (384 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)			FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1		Q1 2020
SM7150-AA,	Snapdragon 730		2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 610 MHz (312.3 GFLOPS in FP32)	Hexagon 688 (3.6 TOPs)	Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q2 2019
SM7150-AB	Snapdragon 730G			Adreno 618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC	Snapdragon 732G		2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 800 MHz (409.6 GFLOPS in FP32)					FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q3 2020
SM7225	Snapdragon 750G		2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55)	Adreno 619 800 MHz (409.6 GFLOPS in FP32)	Hexagon 694 (4.7 TOPs)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)	Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q4 2020
SM7250-AA,	Snapdragon 765	7 nm (Samsung 7LPP)	1x 2.3 GHz {765} Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 540 MHz (414.7 GFLOPS in FP32)	Hexagon 696 (5.4 TOPs)	Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q1 2020
SM7250-AB	Snapdragon 765G		1x 2.4 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 625 MHz (480 GFLOPS in FP32)
SM7250-AC	Snapdragon 768G		1x 2.8 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 750 MHz (576 GFLOPS in FP32)					FastConnect 6200; Bluetooth 5.2; NFC; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q2 2020
SM7325	Snapdragon 778G	6 nm (TSMC N6)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 550 MHz (563.2 GFLOPS in FP32)	Hexagon 770 (12 TOPs)	Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		Q2 2021
SM7325-AE	Snapdragon 778G+		1x 2.5 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 608 MHz (622.6 GFLOPS in FP32)							Q4 2021
SM7350-AB	Snapdragon 780G	5 nm (Samsung 5LPE)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642 490 MHz (752.6 GFLOPS in FP32)		Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		Q1 2021
SM7325-AF	Snapdragon 782G	6 nm (TSMC N6)	1x 2.7 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 719 MHz (736.3 GFLOPS in FP32)		Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		Q4 2022

Snapdragon 7 (2022–2024)

The Snapdragon 7 Gen 1 was announced on May 20, 2022.
The Snapdragon 7+ Gen 2 was announced on March 17, 2023.
The Snapdragon 7s Gen 2 was announced on September 15, 2023.
The Snapdragon 7 Gen 3 was announced on November 17, 2023.
The Snapdragon 7+ Gen 3 was announced on March 21, 2024.
The Snapdragon 7s Gen 3 was announced on August 20, 2024.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7450-AB	Snapdragon 7 Gen 1	4 nm (Samsung 4LPE)	1x 2.4 GHz {2.5 GHz Accelerated Edition} Kryo Prime (Cortex-A710) + 3x 2.36 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 644 443 MHz (680.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q2 2022
SM7475-AB	Snapdragon 7+ Gen 2	4 nm (TSMC N4)	1x 2.91 GHz Kryo Prime (Cortex-X2) + 3x 2.49 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 725 580 MHz (1187.8 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)			FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q1 2023
SM7435-AB	Snapdragon 7s Gen 2	4 nm (Samsung 4LPE)	4 + 4 cores (2.4 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)	Adreno 710 940 MHz (481.3 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q3 2023
SM7550-AB	Snapdragon 7 Gen 3	4 nm (TSMC N4P)	1x 2.63 GHz Kryo Prime (Cortex-A715) + 3x 2.4 GHz Kryo Gold (Cortex-A715) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 720 975 MHz (998.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)		Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2023
SM7675-AB	Snapdragon 7+ Gen 3		1× 2.8 GHz Kryo Prime (Cortex-X4) + 4× 2.6 GHz Kryo Gold (Cortex-A720) + 3× 1.9 GHz Kryo Silver (Cortex-A520)	Adreno 732 950 MHz (1459.2 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)		FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		Q1 2024
SM7635	Snapdragon 7s Gen 3		1× 2.5 GHz Kryo Prime (Cortex-A720) + 3× 2.4 GHz Kryo Gold (Cortex-A720) + 4× 1.8 GHz Kryo Silver (Cortex-A520)	Adreno 810	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q3 2024

Snapdragon 8 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 8 series

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800 series (2013–2021)

Features of the Snapdragon 800 series

The Snapdragon 800 was announced on January 8, 2013. CPU features 4 cores up to 2.36 GHz Krait 400 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache GPU features Adreno 330 GPU Up to 128 ALU (From 96 on Adreno 320) Up to 1024 KB On-chip graphics memory (From 512 KB on Adreno 320) Up to x30 relative performance on OpenGL ES 2.0 from Adreno 200 Support OpenGL ES 3.0 (Over 2.0 Adreno Adreno 225) Unified shader model Scalar instruction set (from Unified shader model 5-way VLIW on 2xx Adreno series) DSP features H.264, VP8 UHD/30fps encoding/decoding (From 1080p60) ISP features Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supports HDRI) Throughput: 0.64 GP/sec Up to 320 MHz Modem and wireless features Wi-Fi 802.11ac wave 1 support Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models SOC features eMMC 4.5 support USB 2.0 and 3.0 Qualcomm Quick Charge 2.0 28 nm HPm (From 28 nm HP) Up to 1 billion transistors Die size: 118mm² The Snapdragon 801 was announced on February 24, 2014. CPU features 4 cores up to 2.45 GHz Krait 400 DSP features H.265 HD/30fps software decoding ISP features Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800) Up to 465 MHz (From 320 MHz on S800) eMMC 5.0 support (Up to 400 MB/s) DSDA The Snapdragon 805 was announced on November 20, 2013. CPU features 4 cores up to 2.7 GHz Krait 450 Up to 128-bit wide LPDDR3 memory interface GPU features Adreno 420 GPU Up to 128 ALU Hardware dynamic tessellation support Support for hull, domain and geometry shaders Update with new dedicated connection to the memory controller(From shared bus with the video decoder and ISP) Up to 40% increase performance in shader hardware 1.5x larger L2 cache (1536 KB from 1024 KB) Better anisotropic filtering support Larger texture cache Full support Direct3D Feature Level 11_2 and OpenCL 1.2 DSP features Improve H.265 support : UHD/30fps hardware decoding 1080p 120fps encoding and decoding ISP features Up to 55 megapixel Throughput: 1.0 GP/sec (From 0.64 GP/sec on SD800) Modem and wireless features External modem The Snapdragon 808 and 810 were announced on April 7, 2014. Snapdragon 808 notable features over its predecessor (805): CPU features ARMv8-A 64-bit architecture (with Global Task Scheduling) 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53) Up to 48 KB Data + 32 KB Instr. L1 cache (From 16 KB + 16 KB) GPU features Up to 128 ALU Adreno 418 GPU with support for Vulkan 1.0 Support OpenGL ES 3.1 Full support Direct3D Feature Level 11_2 and OpenCL 1.2 DSP features Hexagon V56 DSP ISP features 12-bit dual-ISP up to 21 MP SOC features 2 billion transistor Snapdragon 810 notable features over its lower end version (808): CPU features 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53) GPU features Adreno 430 GPU with support for Vulkan 1.0 Full support Direct3D Feature Level 11_2 and OpenCL 1.2 4K main display support Up to 192 ALU (From 128 on Adreno 330) ISP features 14-bit dual-ISP up to 55 MP Throughput: 1.2 GP/sec (From 1.0 GP/sec on SD805) ISP is clocked at 600 MHz DSP features H.264, H.265 UHD/30fps encoding and decoding Modem and wireless features Snapdragon X10 LTE modem Cat 9: download up to 450 Mbit/s Upload up to 50 Mbit/s Bluetooth 4.1 SOC features 20 nm manufacturing technology 2.5 billion transistor The Snapdragon 820 was announced at the Mobile World Congress in March 2015, with the first phones featuring the SoC released in early 2016. Notable features over its predecessors (808 and 810): CPU features Custom Kryo quad-core CPU Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB L3 cache shared between CPU cluster GPU features Adreno 530 GPU with support for Vulkan 1.0 Less L2 GPU cache (1024 KB from 1536 KB) DirectX 12, OpenCL 2.0, OpenGL ES 3.2 DSP features Hexagon 680 DSP 1st generation "AI engine" Down to 2-3 time power consumption (From SD808) New low power island (LPI) for sensor aware apps Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) Halide and TensorFlow support H.264, H.265 UHD/30fps encoding H.264, H.265 10-bit, VP9 UHD/60fps decoding ISP features Qualcomm Spectra ISP with Dual 14-bit ISPs 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS Throughput: 1.2GP/sec (Same as 810) Modem and wireless features Snapdragon X12 LTE modem Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM Support MIMO 4×4 802.11a/b/g/n/ac Wi-Fi connectivity Wi-Fi ad support with external chip SOC features 14 nm FinFET process eMMC 5.1/UFS 2.0 Quick Charge 3.0 2.0 billion transistors Max 8 GB LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) The Snapdragon 821 was announced in July 2016. The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820. Notable features over its predecessor (820): CPU features Faster CPU (+10%) GPU features Faster GPU 650 MHz from 624 (+5%) Snapdragon VR-SDK. ISP features Support Dual PD (PDAF). Extended laser Auto-focus. The Snapdragon 835 was announced on November 17, 2016. Notable features over its predecessor (821): CPU features Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors 4 Kryo 280 Gold (ARM Cortex-A73) L1 cache: 64 KB + 64 KB L2 cache: 2 MB 4 Kryo 280 Silver (ARM Cortex-A53) LPDDR4X in dual-channel mode, up to 1866 MHz GPU features Adreno 540 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0 and OpenGL ES 3.2 Quad-Core GPU @ 710/670 MHz with 256 ALUs, 16 TMUs and 12 ROPs @ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s @ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s Qualcomm Q-Sync (Variable Refresh Rate) and Adreno Foveation (Foveated Rendering) DSP features Hexagon 682 DSP 2nd generation "AI engine" Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) Halide and TensorFlow support H.264, H.265, VP9 UHD/30fps encoding and UHD/60fps 10-bit decoding High-dynamic-range video support(HDR10)/Ultra HD Premium (only Decoding) DSD and 32-bit/384 kHz PCM audio support with WCD9341 codec ISP features: Qualcomm Spectra 180 ISP with Dual 14-bit ISPs Single Camera, 30fps: Up to 32 MP 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL Video Capture: Up to 4K Ultra HD video capture @ 30FPS Video Playback: Up to 4K Ultra HD video playback Codec Support: H.265 (HEVC), H.264 (AVC), VP9 Modem and wireless features Snapdragon X16 LTE modem Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression) 802.11a/b/g/n/ac/ad Wi-Fi connectivity Bluetooth 5.0 (From Bluetooth 4.1) SOC features 10 nm FinFET (Samsung 10LPE) Die size: 72.3mm² 3 billion Transistors UFS 2.1, SD 3.0 (UHS-I) DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery Qualcomm Quick Charge 4 Up to 8 GB LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) The Snapdragon 845 was announced on December 7, 2017. Notable features over its predecessor (835): CPU features Samsung 10nm FinFET Low-Power Plus fabrication 4 Kryo 385 Gold (ARM Cortex-A75) L1 cache: 64 KB + 64 KB L2 cache: 256 KB 4 Kryo 385 Silver (ARM Cortex-A55) DynamIQ with 2 MiB L3 cache 3 MiB system-level cache for CPU, GPU, DSP... GPU features Adreno 630 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality (XR) Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs (up from 256 ALUs, 16 TMUs and 12 ROPs) 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s Inside-out Room-Scale 6DoF with simultaneous localization and mapping (SLAM) Advanced visual inertial odometry (VIO) And Adreno Foveation Support for HDR10 and hybrid log–gamma (HLG) DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery DSP features Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS) Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) Caffe, Caffe2, Halide and TensorFlow support Up to 4K Ultra HD @ 60 FPS (From 4K30 Encode), 2x 2400x2400 @ 120 FPS (VR) Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion) 10-bit color depth (encoding and decoding) on H.264, H.265 and (decode only) VP9 BT.2020 support on DSP and GPU ISP features: Qualcomm Spectra 280 ISP with Dual 14-bit ISPs 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL Modem and wireless features Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers Uplink: 2x20 MHz carrier aggregation, up to 64-QAM Bluetooth enhancements Ultra-low power wireless earbuds Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers Wi-Fi ad 60 GHz with external Module Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS System on a chip features 10 nm FinFET (Samsung 10LPP) Die size: 94 mm² (5.3) billion Transistors Secure Vault (SPU) Native DSD support, PCM up to 384 kHz/32bit Qualcomm Quick Charge 4+ Up to 8 GB LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) The Snapdragon 855 was announced on December 5, 2018. The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset. Notable features over its predecessor (845): 7 nm (TSMC N7) process Die size: 73 mm² (8.48 mm × 8.64 mm) 6.7 billion transistors Support up to 16 GB LPDDR4X 2133 MHz support 4x 16-bit memory bus, (34.13 GB/s) up to 16 GB NVM Express 2x 3.0 (1x for external 5G modem) CPU features 1 Kryo 485 Prime (Cortex-A76), up to 2.84 GHz. Prime core with 512 KB pL2 3 Kryo 485 Gold (Cortex-A76), up 2.42 GHz. Performance cores with 256 KB pL2 each 4 Kryo 485 Silver (Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamIQ with 2 MB sL3 cache 3 MB system-level cache GPU features Adreno 640 GPU with support for Vulkan 1.1 Up to 768 ALU (From 512 on Adreno 630) Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs) 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth HDR gaming (10-bit color depth, Rec. 2020) 120 fps gaming Improvement on hardware-accelerated H.265 and VP9 decoder HDR playback codec support for HDR10+, HDR10, HLG and Dolby Vision Volumetric VR video playback 8K 360 VR video playback Quarterly GPU driver updates via Google Play Store Android GPU Inspector Tool DSP features Hexagon 690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS) Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions Qualcomm Hexagon Tensor Accelerator (HTA) Qualcomm Hexagon Voice Assistant All-Ways Aware Hub Caffe, Caffe2, Halide and TensorFlow support Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance ISP features: Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision Multi-frame noise reduction Hybrid AF 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL HEIF photo capture support Tri-core hardware CV functions including object detection & tracking, and stereo depth processing Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut Up to 1.32 Gpixel/s Video Capture Formats: HDR10, HLG Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10+, VP8, VP9 Modem and wireless features: Internal X24 LTE Modem Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM External Snapdragon X50 (5G Modem): 5000 Mbit/s DL Qualcomm Wi-Fi 6-ready mobile platform: Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz MIMO Configuration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS) Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 Qualcomm 60 GHz Wi-Fi mobile platform Wi-Fi Standards: 802.11ad, 802.11ay Wi-Fi Spectral Band: 60 GHz Peak speed: 10 Gbit/s The Snapdragon 855+ was announced on July 15, 2019. It is an overclocked version of the Snapdragon 855 providing 10% higher CPU and GPU performance. The Snapdragon 860 was announced on March 22, 2021. It is a pure rebranding of the Snapdragon 855+. The Snapdragon 865 was announced on December 4, 2019. Notable features over its predecessor (855): 2nd generation 7 nm (N7P TSMC) process 10.3 billion transistors 83.54 mm2 (8.49 mm x 9.84 mm) Support up to 16 GB LPDDR5 2750 MHz or LPDDR4X 2133 MHz support 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB NVM Express 2x 3.0 (1x for external 5G modem) Support Quick charge 4+ CPU features 1 Kryo 585 Prime (Cortex-A77), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Prime core with 512 KB pL2 3 Kryo 585 Gold (Cortex-A77), 2.42 GHz. Performance cores with 256 KB pL2 each 4 Kryo 585 Silver (Cortex-A55), 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamIQ with 4 MB sL3, 25% performance uplift and 25% power efficiency improvement 3 MB system-level cache GPU features Adreno 650 GPU with support for Vulkan 1.1 25% faster graphics rendering and 35% more power efficient Quarterly GPU driver updates via Google Play Store Android GPU Inspector Tool Desktop Forward Rendering Up to 1029.1 GFLOPs FP32 (From 898.5 GFLOPs on SD855) DSP features Hexagon 698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS) Quad-core Qualcomm Hexagon Tensor Accelerator (HTA) Deep learning bandwidth compression ISP features: Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision Multi-frame noise reduction Hybrid AF 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL 8K 30 FPS and 4K 120 FPS HDR video Up to 2 Gpixel/s Video capture formats: Dolby Vision, HDR10, HDR10+, HEVC Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9 New functionalities to improve noise reduction and local contrast enhancements Modem and wireless features: External X55 5G Modem Modes: NSA, SA, TDD, FDD 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM Dynamic Spectrum Sharing (DSS) Qualcomm Wi-Fi 6-ready mobile platform: Qualcomm FastConnect 6800 (for 865 and 870), 6900 (for 865+) Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E for 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+) MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 Qualcomm 60 GHz Wi-Fi mobile platform Wi-Fi Standards: 802.11ad, 802.11ay Wi-Fi spectral band: 60 GHz Peak speed: 10 Gbit/s Other features: Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support The Snapdragon 865+ was announced on July 8, 2020. The Snapdragon 870 was announced on January 19, 2021. The only difference between it and the Snapdragon 865+ is a minor 0.1 GHz increase in clock frequency on the prime core. The Snapdragon 888 was announced on December 1, 2020. Notable features over its predecessor (865): 5 nm (Samsung 5LPE) process ~10 billion transistors Support up to 16 GB LPDDR5 3200 MHz (51.2  GB/s) 4x 16-bit memory bus Quick Charge 5 (100 W+) Support UFS 3.1 CPU features 1 Kryo 680 Prime (ARM Cortex-X1), up to 2.84 GHz. Prime core with 1 MB pL2 and 64 KB pL1 3 Kryo 680 Gold (ARM Cortex-A78), up 2.42 GHz. Performance cores with 512 KB pL2 each 4 Kryo 680 Silver (ARM Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each Move to instruction set ARMv8.4-A (From ARMv8.2-A) DynamIQ with 4 MB sL3, 25% performance uplift and 25% power efficiency improvement 3 MB system-level cache GPU features Adreno 660 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1 Up to 840 MHz (From 670 MHz on 865+ and 870) 35% faster graphics rendering and 20% more power efficient 73% AI performance boost (From 15 TOPS to 26 TOPS) Variable rate shading (VRS) Demura and subpixel rendering for OLED uniformity Up to 1720.3 GFLOPs FP32 (From 1202.1 GFLOPs on SD865) HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG HDR gaming (including 10-bit color depth, Rec. 2020 color gamut) On-device display: 4K@60 Hz, QHD+@144 Hz External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+ DSP features Hexagon 780 with Fused AI Accelerator architecture 6th generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865. Hexagon Tensor Accelerator Hexagon Vector eXtensions Hexagon Scalar Accelerator Qualcomm Sensing Hub (2nd generation) New dedicated AI processor 80% task reduction offload from Hexagon DSP 5X more processing power 16X larger shared memory 1000X hand off time improvement in certain use cases 50% faster scalar accelerator, 2x faster tensor accelerator Video codec playback support: H.264 (AVC), H.265 (HEVC), VP8, VP9 ISP features: Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag) Dual camera: 64+25 MP at 30 fps with MFNR/ZSL Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo Slow-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG HDR photo capture: 10-bit HDR HEIF Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors Real-time object classification, segmentation, and replacement AI-based auto-focus, auto-exposure and auto-white-balance Advanced HW-based face detection with deep learning filter New low-light architecture (capture photos in 0.1 lux) 2.7 Gigapixel per second ISP (+35% speed increase over S865) 120 photos at 12MP/s Modem and wireless features: Internal X60 5G Modem Modes: NSA, SA, TDD, FDD 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM Dynamic Spectrum Sharing (DSS) Bluetooth 5.2 Dual antennas Premium audio Qualcomm Wi-Fi 6-ready mobile platform: Qualcomm FastConnect 6900 Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2) Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 Other features: Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support Adds compatibility with Content Authenticity Initiative The Snapdragon 888+ was announced on June 28, 2021.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8074AA	Snapdragon 800	28 nm (TSMC 28HPM)	4 cores up to 2.26 GHz Krait 400	Adreno 330 450 MHz (115.2 GFLOPS in FP32)	Hexagon QDSP6 V5 600 MHz	Up to 21 MP single camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)	—	Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B	2.0	Q2 2013
MSM8274AA								Gobi 3G (UMTS)
MSM8674AA								Gobi 3G (CDMA/UMTS)
MSM8974AA								Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3	Snapdragon 801							Gobi 4G (LTE Cat 4)			Q3 2014
APQ8074AB v3			4 cores up to 2.36 GHz Krait 400	Adreno 330 578 MHz (150 GFLOPS in FP32)			LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	—			Q4 2013
MSM8274AB	Snapdragon 800							Gobi 3G (UMTS)			Q4 2013
MSM8674AB v3	Snapdragon 801							Gobi 3G (CDMA/UMTS)			Q2 2013
MSM8974AB v3								Gobi 4G (LTE Cat 4)			Q4 2013
MSM8274AC v3			4 cores up to 2.45 GHz Krait 400					Gobi 3G (UMTS)			Q2 2014
MSM8974AC v3								Gobi 4G (LTE Cat 4)			Q1 2014
APQ8084	Snapdragon 805		4 cores up to 2.7 GHz Krait 450	Adreno 420 600 MHz (153.6 GFLOPS in FP32)	Hexagon V50 800 MHz	Up to 55 MP single camera	LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)	External	Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B		Q1 2014
MSM8992	Snapdragon 808	20 nm (TSMC)	2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)	Adreno 418 600 MHz (153.6 GFLOPS in FP32)	Hexagon V56 800 MHz	Up to 21 MP single camera	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1; 802.11ac; IZat Gen8C		Q3 2014
MSM8994	Snapdragon 810		4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)	Adreno 430 600 MHz (230.4 GFLOPS in FP32)		Up to 55 MP single camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994v2				Adreno 430 630 MHz (241.9 GFLOPS in FP32)							2015
MSM8994v2.1											Q2 2015
MSM8996 Lite	Snapdragon 820	14 nm FinFET (Samsung 14LPP)	2 + 2 cores Kryo (1.804 GHz + 1.363 GHz)	Adreno 530 510 MHz (261.1 GFLOPS in FP32)	Hexagon 680 1 GHz	Spectra	LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)	Bluetooth 4.1; 802.11ac/ad; IZat Gen8C	3.0	Q1 2016
MSM8996			2 + 2 cores Kryo (2.15 GHz + 1.593 GHz)	Adreno 530 624 MHz (319.5 GFLOPS in FP32)			LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)				Q4 2015
MSM8996 Pro-AB	Snapdragon 821										Q3 2016
MSM8996 Pro-AC			2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz)	Adreno 530 653 MHz (334.3 GFLOPS in FP32)
MSM8998	Snapdragon 835	10 nm FinFET (Samsung 10LPE)	4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53)	Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4.0	Q2 2017
SDM845	Snapdragon 845	10 nm FinFET (Samsung 10LPP)	4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPs)	Spectra 280		X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	Q1 2018
SM8150	Snapdragon 855	7 nm (TSMC N7)	1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 640 585 MHz (898.6 GFLOPS in FP32)	Hexagon 690 (7 TOPs)	Spectra 380	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q1 2019
SM8150-AC	Snapdragon 855+		1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 640 675 MHz (1036.8 GFLOPS in FP32)							Q3 2019
	Snapdragon 860										Q1 2021
SM8150P	Snapdragon 855+							Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)			Q3 2019
SM8250	Snapdragon 865	7 nm (TSMC N7P)	1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 587 MHz (901.6 GFLOPS in FP32)	Hexagon 698 (15 TOPs)	Spectra 480	LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: no + External : X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q1 2020
SM8250-AB	Snapdragon 865+		1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 670 MHz (1029.1 GFLOPS in FP32)					FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q3 2020
SM8250-AC	Snapdragon 870		1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)						FastConnect 6800; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q1 2021
SM8350	Snapdragon 888	5 nm (Samsung 5LPE)	1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)	Adreno 660 840 MHz (1290.2 GFLOPS in FP32)	Hexagon 780 (26 TOPs)	Spectra 580	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q1 2021
SM8350-AC	Snapdragon 888+		1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)		Hexagon 780 (32 TOPs)						Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021.

Notable features over its predecessor (888):

• 4 nm (Samsung 4LPX) process
• ~ billion transistors
• Support up to 16 GB LPDDR5 3200 MHz
• Quick Charge 5 (100 W+)
• Support UFS 3.1
• CPU features
  • 1 Kryo Prime (ARM Cortex-X2), up to 3 GHz. Prime core
  • 3 Kryo Gold (ARM Cortex-A710), up 2.5 GHz. Performance cores
  • 4 Kryo Silver (ARM Cortex-A510), up 1.8 GHz. Efficiency cores
  • Move to instruction set ARMv9 (From ARMv8.2-A)
  • DynamIQ with 4 MB sL3,
  • 20% performance uplift and 30% power efficiency improvement
  • 6 MB system-level cache
• GPU features
  • Adreno 730 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
  • 30% faster graphics rendering and 25% more power efficient
  • Up to 1024 ALU (From 768 on Adreno 660)
  • Demura and subpixel rendering for OLED uniformity
  • Variable Rate Shading Pro
  • HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
  • HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
  • On-device display: 4K@60 Hz, QHD+@144 Hz
  • External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
• DSP features
  • Hexagon with Fused AI Accelerator, INT8 and INT16
    • Hexagon Tensor Accelerator
    • Hexagon Vector eXtensions
    • Hexagon Scalar Accelerator
  • Qualcomm Sensing Hub (3nd generation)
    • New dedicated AI pro
• ISP features
  • Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
  • Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
  • Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
  • Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
  • 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
  • Slow-m 5G NR, LTE including CBRS
  • WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • 720p @ 960 FPS
  • HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
  • HDR photo capture: 10-bit HDR HEIF
  • Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
  • Real-time object classification, segmentation, and replacement
  • AI-based auto-focus, auto-exposure and auto-white-balance
• Modem and wireless features:
  • Internal X65 5G Modem
  • Modes: NSA, SA, TDD, FDD
  • 5G mmWave
  • 5G sub-6 GHz
  • 5G NR Sub-6 + mmWave download: 10 Gbit/s
  • 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed)
  • LTE download: 2.5 Gbit/s
  • LTE upload: 0.316 Gbit/s
  • Dynamic Spectrum Sharing (DSS)
  • Bluetooth 5.3
    • Qualcomm Aqstic audio codec (WCD9385)
    • Provide lossless wireless audio with Qualcomm aptX Technology.
  • Qualcomm Wi-Fi 6-ready mobile platform:
    • Qualcomm FastConnect 6900
    • Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
    • MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
    • Peak speed: 3.6 Gbit/s

The Snapdragon 8+ Gen 1 was announced on May 20, 2022.

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8450	Snapdragon 8 Gen 1	4 nm (Samsung 4LPX)	1x 3.0 GHz Kryo Prime (Cortex-X2) + 3x 2.5 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 730 818 MHz (1675.3 GFLOPs in FP32)	Hexagon 52 TOPS, some cases up to 104 TOPS	Spectra	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X65 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2021
SM8475	Snapdragon 8+ Gen 1	4 nm (TSMC N4)		Adreno 730 900 MHz (1843.2 GFLOPS in FP32)							Q2 2022
			1x 3.2 GHz Kryo Prime (Cortex-X2) + 3x 2.75 GHz Kryo Gold (Cortex-A710) + 4x 2.0 GHz Kryo Silver (Cortex-A510)

Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022.

Notable features over its predecessor (8 Gen 1):

• 4nm (TSMC N4) process
• Support up to 16 GB LPDDR5X 4200 MHz
• Support UFS 4.0
• CPU features
  • 1 Kryo Prime (ARM Cortex-X3), up to 3.36 GHz. Prime core
    • 1 MB L2 cache
    • Only 64-bit support
  • 2 Kryo Gold (ARM Cortex-A715), up to 2.8 GHz. High Performance cores
    • Only 64-bit support
  • 2 Kryo Gold (ARM Cortex-A710), up to 2.8 GHz. Performance cores
    • 32-bit and 64-bit support
  • 3 Kryo Silver (ARM Cortex-A510), up to 2 GHz. Efficiency cores
    • 32-bit and 64-bit support
  • 35% performance uplift and 40% power efficiency improvement
  • 8 MB system-level cache
• GPU features
  • Adreno 740 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
  • 25% faster graphics rendering and 45% more power efficient
  • Up to 1536 ALU (From 1024 on Adreno 730)
  • Real-time hardware-accelerated ray tracing
    • ray-box and ray-triangle intersections
    • Bounding Volume Hierarchical (BVH)
  • Doubled bandwidth between ISP, Hexagon DSP, and Adreno GPU
• DSP features
  • Hexagon with Fused AI Accelerator
    • Hexagon Tensor Accelerator
    • Hexagon Vector eXtensions
    • Hexagon Scalar Accelerator
    • Mixed precision INT8/INT16
    • Add INT4 support
    • INT4, INT8, INT16, FP16 support
    • Hexagon Direct Link (ISP and Hexagon)
  • Qualcomm Sensing Hub (4th generation)
    • Add second AI processor
    • x2 performance from last year
    • Dedicated power delivery system
    • 50% more memory
• ISP features
  • Video capture up to 8K30 or 4K120 or 720p960 (HDR)
  • Video playback up to 8K60 or 4K120 (HDR)
  • H.264, H.265, VP9 and add AV1 decoding
  • Photo is same as 8 Gen 1
• Modem and wireless features:
  • Similar as 8 Gen 1
  • Qualcomm FastConnect 7800
  • Internal X70 5G Modem
  • 5G up to 10 Gbit/s down and 3,5 Gbit/s up
  • Wi-Fi 7 support
  • Bluetooth 5.3 support
  • Dual Bluetooth radios

There is an overclocked variant of the Snapdragon 8 Gen 2 with model number SM8550-AC. It was exclusive to the Samsung Galaxy S23 series on launch. Nubia's Red Magic 8S Pro became the first non-Galaxy phone to feature this variant, launching July 5th 2023.

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8550-AB	Snapdragon 8 Gen 2	4 nm (TSMC N4)	1× 3.2 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno 740 680 MHz (2089 GFLOPS in FP32)	Hexagon	Spectra	LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 or FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2022
SM8550-AC	Snapdragon 8 Gen 2 for Galaxy		1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno 740 719 MHz (2208.8 GFLOPS in FP32)							Q1 2023

Snapdragon 8/8s Gen 3 (2024)

The Snapdragon 8 Gen 3 was announced on October 24, 2023.

Notable features over its predecessor (8 Gen 2):

• Support for memory up to 4800 MHz (up from 4200 MHz)
• CPU features
  • 1 Kryo Prime (ARM Cortex-X4), up to 3.3 GHz. Prime core
  • 3 Kryo Gold (ARM Cortex-A720), up to 3.2 GHz. High Performance cores
  • 2 Kryo Gold (ARM Cortex-A720), up to 3.0 GHz. Performance cores
  • 2 Kryo Silver (ARM Cortex-A520), up to 2.3 GHz. Efficiency cores
  • 30% performance uplift and 20% power efficiency improvement
  • 12 MB L3 cache (up from 8 MB)
• GPU features
  • Adreno 750 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
  • 25% faster graphics rendering and 25% more power efficient
• DSP features
  • Hexagon NPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing.
• ISP features
  • Photo expansion
  • Video Object Eraser
  • Night Vision video capture
  • Dolby HDR video capture
• Modem and wireless features:
  • Internal X75 5G Modem
  • Bluetooth 5.4 support

The Snapdragon 8s Gen 3 was announced on March 18, 2024.

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8650-AB	Snapdragon 8 Gen 3	4 nm (TSMC N4P)	1× 3.30 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno 750 903 MHz (2774 GFLOPS in FP32)	Hexagon	Spectra	LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)	Internal: X75 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2023
SM8650-AC	Snapdragon 8 Gen 3 for Galaxy		1× 3.40 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno 750 1000 MHz (3072 GFLOPS in FP32)							Q1 2024
SM8635	Snapdragon 8s Gen 3		1× 3.0 GHz Kryo Prime (Cortex-X4) + 4× 2.8 GHz Kryo Gold (Cortex-A720) + 3× 2.0 GHz Kryo Silver (Cortex-A520)	Adreno 735 1100 MHz (1689.6 GFLOPS in FP32)			LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 6.5 Gbit/s, upload up to 3.5 Gbit/s)			Q1 2024

Mobile Compute Platforms

Further information: Devices using Qualcomm Snapdragon processors § Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018. It is essentially an over-clocked version of the Snapdragon 845.

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8998	Snapdragon 835 Mobile PC Platform	10 nm (Samsung 10LPE)	Kryo 280 4 + 4 cores (2.6 GHz + 1.9 GHz)	Adreno 540 710 MHz (363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4	Q2 2018
SDM850	Snapdragon 850 Mobile Compute Platform	10 nm (Samsung 10LPP)	Kryo 385 4 + 4 cores (2.96 GHz + 1.77 GHz)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	Q3 2018

Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC7180	Snapdragon 7c	8 nm (Samsung 8LPP)	Kryo 468 2 + 6 cores (up to 2.4 GHz)	Adreno 618 825 MHz (422.4 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 255 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad/ax (Wi-Fi 6); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0		Q1 2020
SC7180P	Snapdragon 7c Gen 2		Kryo 468 2 + 6 cores (up to 2.55 GHz)								Q2 2021
SC7280	Snapdragon 7c+ Gen 3	6 nm (TSMC N6)	Kryo 4 Gold + 4 Silver cores (Cortex-A78r1p1, up to 2.4 GHz) + Cortex-A55 r2p0		Hexagon (6.5 TOPS)	Spectra (64 MP single camera / 36+22 MP dual camera)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD		Q1 2022

Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180	Snapdragon 8c	7 nm (TSMC N7)	Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz)	Adreno 675 590 MHz	Hexagon 690 (9 TOPS)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X55 5G/LTE (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q1 2020

Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.
Notable features over the Snapdragon 855:

• 10 MB total cache (L3 + SLC)
• 8x 16-bit memory bus, (68.3 GB/s)
• NVM Express 4x
• 112.05 mm2 die size

The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.

Notable features over the Snapdragon 888:

• 8 MB L3 cache & 6 MB SLC (14 MB total cache)
• 8x 16-bit memory bus, (68.3 GB/s)
• NVM Express 4x
• Built-in Microsoft Pluton TPM

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180X	Snapdragon 8cx	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 680 585 MHz (1797.1 GFLOPS in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (32 MP single camera / 16 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q3 2019
SC8180XP	Snapdragon 8cx Gen 2 5G		Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 690 660 MHz (2027.5 GFLOPS in FP32)				No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.4 Gbit/s, NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD		Q3 2020
SC8280	Snapdragon 8cx Gen 3	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)	Adreno 695 900 MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q1 2022

Microsoft SQ Compute Platforms

Further information: Devices using Qualcomm Snapdragon processors § SQ

The Microsoft SQ1 was announced on October 2, 2019. Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.

Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Microsoft SQ1	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 685 590MHz (1812.5 GFLOPs in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q4 2019
Microsoft SQ2		Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)	Adreno 690 680MHz (2089 GFLOPs in FP32)							Q4 2020
Microsoft SQ3	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)	Adreno 695 900MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q3 2022

Snapdragon X series

The Snapdragon X Elite was announced on October 24, 2023.
The Snapdragon X Plus was announced on April 24, 2024.

Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon X Plus
X1P-64-100	4 nm (TSMC N4)	Oryon 10 core (3.4 GHz)	Adreno X1 1250 MHz (3.8 TFLOPS)	Hexagon (45 TOPS)	Spectra (64 MP single camera / 36 MP dual camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD	Mid-2024
Snapdragon X Elite
X1E-78-100	4 nm (TSMC N4)	Oryon 12 core (3.4 GHz)	Adreno X1 1250 MHz (3.8 TFLOPS)	Hexagon (45 TOPS)	Spectra (64 MP single camera / 36 MP dual camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD	Mid-2024
X1E-80-100		Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100		Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz)	Adreno X1 1500 MHz (4.6 TFLOPS)
X1E-00-1DE		Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

The Snapdragon Wear 1100 processor was announced May 30, 2016 for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1200 processor was announced June 27, 2017 for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches. It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018. It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018. The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020. The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022. The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model number	Product Name	Fab	CPU	Co-processor	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
?	Wear 1100	28 nm	1 core up to 1.2 GHz Cortex-A7 (ARMv7)	—	Fixed Function GPU		LPDDR2	Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s)	Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2016
	Wear 1200		1 core up to 1.3 GHz Cortex-A7 (ARMv7)					Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s)	Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2017
MSM8909w	Wear 2100		4 cores up to 1.2 GHz Cortex-A7 (ARMv7)		Adreno 304	Hexagon	LPDDR3 400 MHz	X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou	Q1 2016
	Wear 2500									Q2 2018
	Wear 3100			QCC1110 (1 core 50 MHz Cortex-M0) 3100 & 4100+ only						Q3 2018
SDM429w	Wear 4100 and 4100+	12 nm + 28 nm	4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A)		Adreno A504 320 MHz	Hexagon QDSP6 V56	1x32 bit LPDDR3 750 MHz		Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q2 2020
SW5100	W5 and W5+ Gen 1	4 nm + 22 nm	4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A)	QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) W5+ only	Adreno A702 1 GHz	Hexagon DSP V66K	1x16 bit LPDDR4 2133 MHz	Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q3 2022

Automotive platforms

The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014.
The Snapdragon 820A was announced on January 6, 2016.

Model number	Product Name	Fab	CPU	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
8064-AU	Snapdragon 602A	28 nm (TSMC 28LP)	4 cores up to 1.5 GHz Krait 300 (ARMv7)	Adreno 320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display)	Hexagon V40 600 MHz	LPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s)	External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS)	Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 802.11n/ac (Wi-Fi 5) 2x2 (MU-MIMO)	Q1 2014
MSM8996AU	Snapdragon 820A	14 nm (Samsung 14LPP)	Kryo 2 + 2 cores (2.15 GHz Gold + 1.59 GHz Silver) (ARMv8)	Adreno 530 624 MHz (319.4 GFLOPs)	Hexagon 680 1 GHz	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1; 802.11ac/ad (Wi-Fi 5); IZat Gen8C	Q1 2016
SA6155P		11 nm (Samsung 11LPP)	Kryo 4xx 2 + 6 cores	Adreno 608/612 (110 GFLOPs)	Hexagon	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal: no	Bluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8155P	Snapdragon 855A	7 nm (TSMC N7)	Kryo 485 1 + 3 + 4 cores (2.96 GHz Prime + 2.42 GHz Gold + 1.80 GHz Silver)	Adreno 640 675 MHz (1036.8 GFLOPs)	Hexagon 690 (>10 TOPS)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)		Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS	Q1 2021
SA8195P			Kryo 495 4 + 4 cores (Cortex-A76 + Cortex-A55)	Adreno 680 600 MHz (1843.2 GFLOPs)	Hexagon	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)		Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8255P		5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (2.35 GHz Prime + 2.35 GHz Gold)	Adreno 663	Hexagon	LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s)		Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8295P			Kryo 695 4 + 4 cores (2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78)	Adreno 695	Hexagon (30 TOPS)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)		Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 1.8 Gbit/s; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS	2023

Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8016E	Snapdragon 410E	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A53 (ARMv8)	Adreno 306	Hexagon QDSP6 V5 691 MHz	Up to 13 MP camera	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	none	Bluetooth 4.0, 802.11n, GPS
APQ8064E	Snapdragon 600E		4 cores up to 1.5 GHz Krait 300 (ARMv7)	Adreno 320 400 MHz	Hexagon QDSP6 V4 500 MHz	Up to 21 MP camera	DDR3/DDR3L Dual-channel 533 MHz		Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074	Snapdragon 800E	28 nm (TSMC 28HPM)	4 cores up to 2.3 GHz Krait 400 (ARMv7)	Adreno 330	Hexagon QDSP6 V5	Up to 55 MP camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)		Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094	Snapdragon 810E	20 nm (TSMC 20SoC)	4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8)	Adreno 430 650 MHz	Hexagon V56 800 MHz	Up to 55 MP camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)		Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096	Snapdragon 820E	14 nm FinFET (Samsung 14LPP)	2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8)	Adreno 530	Hexagon 680 825 MHz	Up to 28 MP camera	LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)		Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
QCS603	10 nm (Samsung 10LPP)	2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver)	Adreno 615 (Quad HD + 4K Ultra HD external display)	Hexagon 685	Spectra 270 (Up to 24 MP camera / 16 MP dual)	LPDDR4X 16-bit 1866 MHz	none	Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+
QCS605		8 cores up to 2.5 GHz Kryo 300			Spectra 270 (Up to 32 MP camera / 16 MP dual)			Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017) was announced on June 14, 2017.
The Qualcomm 212 Home Hub (APQ8009) and Qualcomm 624 Home Hub (APQ8053) were announced on January 9, 2018.

The QCS400 Series was announced March 19, 2019.

Model number	Fab	CPU	GPU	DSP	ISP	Audio	Memory technology	Modem	Connectivity	Sampling availability
APQ8009 (SDA212)	28 nm (TSMC 28LP)	4 cores up to 1.3 GHz Cortex-A7 (ARMv7)	Adreno 304 (HD)	Hexagon 536	Up to 16 MP camera		LPDDR2/3 Single-Channel 533 MHz	none	Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017		4 cores up to 1.4 GHz Cortex-A53 (ARMv8)	Adreno 308 (Full HD)				LPDDR3 Single-channel 667 MHz
APQ8053 (SDA624)	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53 (ARMv8)	Adreno 506 (Full HD+)	Hexagon 546	Up to 24 MP camera / 13 MP dual		LPDDR3
QCS403		Dual-core CPU	none	2x Hexagon V66		12x Audio Channels Supported			Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4	Q1 2019
QCS404		Quad-core CPU
QCS405			Adreno 306 (Full HD+)
QCS407						32x Audio Channels Supported

Mixed Reality (MR) platforms

Snapdragon XR series

• In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.
• The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865. It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
  • The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022, and is used in the Meta Quest Pro.
• On September 27, 2023 Qualcomm announced the Snapdragon XR2 Gen 2 Platform for MR and VR headsets. Qualcomm claims 2.5x higher GPU and 8x better AI performance compared to its predecessor the XR2 5G. The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through. With the support of Wi-Fi 7 network throughput is increased by 60% while latency is decreased by 80%. The platform debuted on the Meta Quest 3.
  • The Snapdragon XR2+ Gen 2 Platform is an overclocked version of the XR2 Gen 2 announced on January 4, 2024. The GPU frequency has been increased by 15% while the CPU frequency has been increased by 20% compared to the XR2 Gen 2. This enables a higher 4.3K resolution per-eye at 90 Hz and the processing of 12 or more concurrent cameras and sensors. This chip forms the basis of the XR headset and ecosystem jointly developed by Qualcomm, Samsung, and Google that has been announced at Galaxy Unpacked in February 2023.

Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Tracking	Connectivity	Sampling availability
XR1	10 nm (Samsung 10LPP)	4x Kryo 385 Gold + 4x Kryo 385 Silver	Adreno 615	Hexagon 685	Spectra	LPDDR4X	3DoF and 6DoF head and controller tracking	WiFi 5 Bluetooth 5	Q1 2019
XR2	7 nm (TSMC N7+)	1x Kryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver	Adreno 650 (up to 2x 3K displays at 90 Hz)	Hexagon 698	Spectra (input from up to 7 cameras)		Full 6DoF head and controller tracking, as well as hand and finger tracking	WiFi 6 Bluetooth 5 5G	Q1 2020
XR2+ Gen1						LPDDR5		WiFi 6E Bluetooth 5.2 5G	Q4 2022
XR2 Gen2	4 nm (TSMC N4)	1x Kryo Prime + 4x Kryo Gold + 3x Kryo Silver	Adreno 740 (up to 2x 3K displays at 90 Hz)	Hexagon	Spectra (input from up to 10 cameras)	LPDDR5X		WiFi 7 Bluetooth 5.3 5G	Q4 2023
XR2+ Gen2			Adreno 740 (up to 2x 4.3K displays at 90 Hz)	Hexagon	Spectra (input from up to 12 cameras)				Q1 2024

Snapdragon AR series

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022. It is intended for use in smart glasses.
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses. It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

Gaming platforms

Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform. The Razer Edge is the first device to use the platform. Analyzing Geekbench listings for the Razer Edge it is fair to assume that the G3x Gen 1 is a rebranding of the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters and clock speeds, and the same GPU. Connectivity options also seem in line.

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.

Product Name	CPU	GPU	Modem	Connectivity	Display	Sampling availability
G1 Gen 1	Kryo (8 core)	Adreno A11	—	Wi-Fi 5, Bluetooth 5.0	HD at 60 fps	Q4 2023
G2 Gen 1		Adreno A21	X62 5G/LTE	Wi-Fi 6/6E, Bluetooth 5.0	FHD+ up to 144 fps
G3x Gen 1	1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)	Adreno 660 900 MHz (1382.4 GFLOPs in FP32)	X60 5G/LTE	Wi-Fi 6E, Bluetooth 5.2		Q1 2023
G3x Gen 2	1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.02 GHz Kryo Silver (Cortex-A510)	Adreno A32 1000 MHz (3072 GFLOPS in FP32)	X70 5G/LTE	Wi-Fi 7, Bluetooth 5.3		Q4 2023

Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair. Qualcomm announced the QCC5100 Series at CES 2018.

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.

Qualcomm QCC300x Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Sampling availability
QCC3001		RISC application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 80 MHz)	Bluetooth 5.0 Dual-mode Bluetooth	TrueWireless Stereo cVc audio		Mono / 2-mic
QCC3002					TrueWireless Stereo aptX Classic/HD/LL cVc audio
QCC3003					cVc audio		Stereo / 1-mic
QCC3004							Stereo / 2-mic
QCC3005					aptX Classic/HD/LL cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Digital Assistant activation	Sampling availability
QCC3020		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio	~6mA (2DP streaming)	Mono / 2-mic	Button press	H1 2017
QCC3021							Stereo / 1-mic
QCC3024					cVc audio Google Fast Pair		Stereo / 2-mic
QCC3026					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Mono / 2-mic
QCC3031					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Stereo / 1-mic
QCC3034					aptX Classic/HD/LL cVc audio Google Fast Pair		Mono / 2-mic
QCC3040		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s	aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair	<5 mA	Stereo / 2-mic	Button press	H1 2020
QCC3046						<5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	Digital Assistant activation	Sampling availability
QCC5120		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair	~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc	Button press Qualcomm Voice Activation	H1 2018
QCC5121
QCC5124
QCC5125			Single core Qualcomm Kalimba DSP (Up to 120 MHz)		aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc	Button press
QCC5141		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s	aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~5mA A2DP stream	Button press Qualcomm Voice Activation	H1 2020
QCC5144

See also

• List of devices using Qualcomm Snapdragon systems on chips
• Qualcomm Adreno
• Qualcomm Hexagon
• List of Qualcomm Snapdragon modems
• Apple M1
• Tegra
• Exynos
• HiSilicon
• List of MediaTek systems on chips
• List of UNISOC systems on chips

External links

• Media related to Snapdragon (microprocessor) at Wikimedia Commons
• Official website, product page